Namitha B. Bejoy , Piotr A. Piatkowski , Wegood M. Awad , Panče Naumov , Ali S. Alnaser
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引用次数: 0
Abstract
Thin films of silicon semiconductor nanocrystals (Si NCs) have a wide range of applications, from serving as saturable absorbers in mode-locked fiber lasers to being used in photovoltaic materials. This study investigates the relationship between the size, structure, morphology, and composition of Si NCs synthesized by femtosecond laser ablation and the optical properties of their thin films deposited on glass substrates. Femtosecond transient absorption spectroscopy of two sets of Si NCs synthesized by laser pulses layered on glass showed that photoinduced excitons efficiently transfer from the crystalline core to trap states-rich shell within a few picoseconds. The ultrafast trapping is followed by excitons redistribution among localized states on a time scale of over tens of picoseconds. Further depopulation of the trap states into the valence band (VB) occurs on a nanosecond timescale, confirming the existence of long-lived trap states. Z-scan measurements revealed that an increase in the laser pulse intensity utilized for Si NCs synthesis reduces the saturation intensities of saturable absorption in thin films from 32.8 MW/cm2 to 1.58 MW/cm2. These findings underscore the significance of surface properties in optimizing Si NC-based optoelectronic devices and their potential impact on the future design of Si nanocrystal-based optical materials.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.