Optical and Thermal Effect of Boron Nitride Nanoplate Additive on Quantum Dot-Converted Light-Emitting Diodes

IF 2.9 2区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Electron Devices Pub Date : 2025-01-07 DOI:10.1109/TED.2024.3521954

Meng Chen;Zhongzhi Tian;Qian Feng;Yonghui Zhang;Chong Geng;Zhencan F. Fan;Jay Guoxu Liu;Shu Xu

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引用次数: 0

Abstract

Quantum dot-converted light-emitting diodes (Qc-LEDs) have attracted significant interest due to their superior color performance in advanced lighting and display applications. Despite this, their efficiency is often compromised by heat-induced fluorescence quenching of quantum dots (QDs). Boron nitride nanoplates (BNPs) are known for their excellent heat dissipation properties, making them a promising additive to reduce heat accumulation in Qc-LEDs. However, BNPs also possess high light reflectivity that traps light within the device, diminishing their overall effectiveness. In this study, we explore the comprehensive optical and thermal impacts of BNPs on Qc-LEDs through simulations and experiments. Results show that 1 wt% BNPs strike a suitable balance, reducing temperature without significantly affecting light extraction efficiency. In contrast, 3 wt% BNPs lower the operating temperature of Qc-LEDs from

$95.3~^{\circ }$

C to

$65.9~^{\circ }$

C at 150 mA but also decrease light intensity by 22% compared to Qc-LEDs with 1 wt% BNPs. This research provides valuable insights for optimizing Qc-LED performance using BNPs and other thermally conductive 2-D nanoadditives.

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来源期刊

IEEE Transactions on Electron Devices 工程技术-工程：电子与电气

CiteScore

5.80

自引率

16.10%

发文量

937

审稿时长

3.8 months

期刊介绍： IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.