Enhancing Broadband 4H-SiC Photodetectors With Gold Nanoparticles: Expanding Sensitivity From UV to SWIR Spectrum

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Lulu Geng;Guohui Li;Wenbin Sun;Xianyong Yan;Wenyan Wang;Ting Ji;Zhihui Chen;Kaili Mao;Yuan Tian;Yanxia Cui
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引用次数: 0

Abstract

4H-silicon carbide (4H-SiC) is promising for photodetectors (PDs) capable of operating at high voltages and elevated temperatures. However, the wide bandgap of 4H-SiC (3.26 eV) restricts its applications to the ultraviolet (UV) range below 400 nm. It is essential to develop 4H-SiC PDs with a broadband response covering the UV to short-wavelength infrared (SWIR) spectrum. This study demonstrates a 4H-SiC broadband PD with sensitivity extending from UV to SWIR range up to 2200 nm. The superior performance is attributed to the presence of numerous defect centers forming deep energy levels within the 4H-SiC bandgap, which allows the absorption of visible (VIS) and SWIR photons with energies lower than the bandgap. Moreover, the incorporation of thermally annealed gold nanoparticles (Au NPs) induces localized plasmonic resonance, significantly enhancing the photocurrent over a broadband wavelength range while maintaining the dark current. This leads to superior weak light detection capabilities for the plasmonic device compared to the reference device without Au NPs. At the enhancement peak (under 860-nm laser illumination), the plasmonic device achieves a minimum detectable power density of $0.488~\mu $ W/cm2. Notably, the plasmonic PD exhibits a 3260% increase in the photo-to-dark current ratio (PDCR), with an external quantum efficiency (EQE) enhancement factor reaching a maximum of 3166%. These results lay a foundation for advancing the development of UV-SWIR broadband SiC PDs.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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