A Low-Profile Filtering Magneto-Electric Dipole Antenna Based on High-Density-Interconnect (HDI) Packaging

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Zhenyao Qian;Yancheng Huang;Bo Wang;Qianqian Qin;Lei Ge;Junfa Mao
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引用次数: 0

Abstract

In this article, an easy-to-integrate millimeter-wave low-profile filtering magneto-electric (ME) dipole antenna is proposed based on organic high-density-interconnect (HDI) packaging. Due to the advantages of high density and high precision of the HDI packaging, vertically oriented folded shorted metal vias and dielectric loading are introduced in the proposed design. The height of the antenna is reduced from $0.25\lambda _{0}$ of conventional ME dipoles to $0.07\lambda _{0}$ . Furthermore, by simply loading a stub, a radiation null can be effectively introduced to achieve filtering response. For demonstration, a prototype was designed and manufactured. Measurement and simulation results are in good agreement, showing that the prototype operates at 22.4–29 GHz, achieving a stable gain of 7 dBi, low cross-polarization level of less than −18 dB, and low back radiation of less than −15 dB, as well as additional good filtering performance with return loss of 13 dB and high selectivity.
基于高密度互连封装的低轮廓滤波磁电偶极子天线
本文提出了一种易于集成的毫米波低轮廓滤波磁电偶极子天线,该天线基于有机高密度互连(HDI)封装。由于HDI封装具有高密度和高精度的优点,在设计中引入了垂直定向的折叠短金属通孔和介电负载。天线的高度从传统ME偶极子的$0.25\lambda _{0}$降低到$0.07\lambda _{0}$。此外,通过简单地加载一个存根,可以有效地引入辐射零值来实现滤波响应。为了演示,设计并制造了一个原型。测试结果与仿真结果吻合良好,样机工作在22.4-29 GHz,稳定增益为7 dBi,低交叉极化电平小于- 18 dB,低背辐射小于- 15 dB,回波损耗为13 dB,具有良好的滤波性能和高选择性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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