Zhenyao Qian;Yancheng Huang;Bo Wang;Qianqian Qin;Lei Ge;Junfa Mao
{"title":"A Low-Profile Filtering Magneto-Electric Dipole Antenna Based on High-Density-Interconnect (HDI) Packaging","authors":"Zhenyao Qian;Yancheng Huang;Bo Wang;Qianqian Qin;Lei Ge;Junfa Mao","doi":"10.1109/TCPMT.2024.3507083","DOIUrl":null,"url":null,"abstract":"In this article, an easy-to-integrate millimeter-wave low-profile filtering magneto-electric (ME) dipole antenna is proposed based on organic high-density-interconnect (HDI) packaging. Due to the advantages of high density and high precision of the HDI packaging, vertically oriented folded shorted metal vias and dielectric loading are introduced in the proposed design. The height of the antenna is reduced from <inline-formula> <tex-math>$0.25\\lambda _{0}$ </tex-math></inline-formula> of conventional ME dipoles to <inline-formula> <tex-math>$0.07\\lambda _{0}$ </tex-math></inline-formula>. Furthermore, by simply loading a stub, a radiation null can be effectively introduced to achieve filtering response. For demonstration, a prototype was designed and manufactured. Measurement and simulation results are in good agreement, showing that the prototype operates at 22.4–29 GHz, achieving a stable gain of 7 dBi, low cross-polarization level of less than −18 dB, and low back radiation of less than −15 dB, as well as additional good filtering performance with return loss of 13 dB and high selectivity.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"15 1","pages":"206-213"},"PeriodicalIF":2.3000,"publicationDate":"2024-11-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10769565/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this article, an easy-to-integrate millimeter-wave low-profile filtering magneto-electric (ME) dipole antenna is proposed based on organic high-density-interconnect (HDI) packaging. Due to the advantages of high density and high precision of the HDI packaging, vertically oriented folded shorted metal vias and dielectric loading are introduced in the proposed design. The height of the antenna is reduced from $0.25\lambda _{0}$ of conventional ME dipoles to $0.07\lambda _{0}$ . Furthermore, by simply loading a stub, a radiation null can be effectively introduced to achieve filtering response. For demonstration, a prototype was designed and manufactured. Measurement and simulation results are in good agreement, showing that the prototype operates at 22.4–29 GHz, achieving a stable gain of 7 dBi, low cross-polarization level of less than −18 dB, and low back radiation of less than −15 dB, as well as additional good filtering performance with return loss of 13 dB and high selectivity.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.