{"title":"Investigation of Atmospheric Pressure Plasma Treatment on PCB Surface Finishes","authors":"Eszter Kocsis;Attila Lukács;István Szalai","doi":"10.1109/TPS.2024.3507074","DOIUrl":null,"url":null,"abstract":"Flux is a necessity in the lead-free soldering process. Inactivated flux residues can cause electrical shortages and functional issues by electrochemical migration. Because of miniaturization and the complexity of recent electronic products, a cleaner manufacturing process is required. Atmospheric pressure plasma treatment (PT) is a commonly applied surface cleaning method in the manufacturing industry and has been proved to be effective in improving the wettability in case of metal and polymer surfaces. Three different types of printed circuit board (PCB) surface finishes were investigated before and after PT. Improvement on wettability of the PCB pads is demonstrated. The aim of this study is to investigate the mechanisms of plasma cleaning and to possibly determine the root cause of the improvement of solderability on PCBs resulting from atmospheric pressure PT. For this investigation of the PCB surface finishes, the scanning electron microscopy (SEM) images were taken, and the composition of the surfaces was analyzed by energy dispersive X-ray spectrometry (EDAX) and laser-induced breakdown spectrometry (LIBS) as well.","PeriodicalId":450,"journal":{"name":"IEEE Transactions on Plasma Science","volume":"52 11","pages":"5345-5349"},"PeriodicalIF":1.3000,"publicationDate":"2024-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Plasma Science","FirstCategoryId":"101","ListUrlMain":"https://ieeexplore.ieee.org/document/10803906/","RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"PHYSICS, FLUIDS & PLASMAS","Score":null,"Total":0}
引用次数: 0
Abstract
Flux is a necessity in the lead-free soldering process. Inactivated flux residues can cause electrical shortages and functional issues by electrochemical migration. Because of miniaturization and the complexity of recent electronic products, a cleaner manufacturing process is required. Atmospheric pressure plasma treatment (PT) is a commonly applied surface cleaning method in the manufacturing industry and has been proved to be effective in improving the wettability in case of metal and polymer surfaces. Three different types of printed circuit board (PCB) surface finishes were investigated before and after PT. Improvement on wettability of the PCB pads is demonstrated. The aim of this study is to investigate the mechanisms of plasma cleaning and to possibly determine the root cause of the improvement of solderability on PCBs resulting from atmospheric pressure PT. For this investigation of the PCB surface finishes, the scanning electron microscopy (SEM) images were taken, and the composition of the surfaces was analyzed by energy dispersive X-ray spectrometry (EDAX) and laser-induced breakdown spectrometry (LIBS) as well.
期刊介绍:
The scope covers all aspects of the theory and application of plasma science. It includes the following areas: magnetohydrodynamics; thermionics and plasma diodes; basic plasma phenomena; gaseous electronics; microwave/plasma interaction; electron, ion, and plasma sources; space plasmas; intense electron and ion beams; laser-plasma interactions; plasma diagnostics; plasma chemistry and processing; solid-state plasmas; plasma heating; plasma for controlled fusion research; high energy density plasmas; industrial/commercial applications of plasma physics; plasma waves and instabilities; and high power microwave and submillimeter wave generation.