Reduction of Graphene Oxide Via Plasma Immersion Ion Implantation

IF 2.6 3区物理与天体物理 Q3 ENGINEERING, CHEMICAL

Plasma Chemistry and Plasma Processing Pub Date : 2024-09-25 DOI:10.1007/s11090-024-10513-4

Kittiya Kosaentor, Chanokporn Chaiwong

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Abstract

Graphene oxide sheets were irradiated with argon and hydrogen plasma in the configuration of plasma immersion ion implantation with a pulsed negative voltage of -5 kV at varying time intervals, ranging from 2 to 8 min. Their characteristics were investigated in terms of surface and structural modification, elemental compositions and bonding, and sheet resistance. The irradiation removed surface irregularities and transformed it into a smoother surface. Raman spectroscopy analysis revealed that the sp² network was restored after the radiation. Due to different energy loss mechanisms, hydrogen irradiation resulted in a smaller size of sp² domains, while argon radiation led to more structural defects. The XPS results showed that a significant amount of hydroxyl/epoxy groups were removed, and an increase in carboxyl groups was observed after the irradiation. This indicates that some surface reactions, such as hydrogenation and adsorption of molecules from the environment, occurred. Conductive graphene oxide sheets were obtained as the sheet resistance of the irradiated graphene oxide was reduced compared to that of the pristine graphene oxide. This demonstrates that PIII could be a potential technique to reduce graphene oxide.

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等离子体浸没离子注入还原氧化石墨烯

以等离子体浸没离子注入方式，在-5 kV脉冲负电压下，以2 ~ 8 min的不同时间间隔对氧化石墨烯片进行氩和氢等离子体辐照。研究了氧化石墨烯片的表面和结构改性、元素组成和键合以及片电阻等特性。辐照消除了表面的不规则性，使其变得更光滑。拉曼光谱分析表明，sp2网络在辐照后恢复。由于能量损失机制不同，氢辐射导致的sp2畴尺寸较小，而氩辐射导致的结构缺陷较多。XPS结果表明，辐照后羟基/环氧基被大量去除，羧基增加。这表明发生了一些表面反应，如氢化和从环境中吸附分子。与原始氧化石墨烯相比，辐照氧化石墨烯的电阻降低，从而获得导电氧化石墨烯片。这表明PIII可能是一种潜在的还原氧化石墨烯的技术。

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来源期刊

Plasma Chemistry and Plasma Processing 工程技术-工程：化工

CiteScore

5.90

自引率

8.30%

发文量

审稿时长

6-12 weeks

期刊介绍： Publishing original papers on fundamental and applied research in plasma chemistry and plasma processing, the scope of this journal includes processing plasmas ranging from non-thermal plasmas to thermal plasmas, and fundamental plasma studies as well as studies of specific plasma applications. Such applications include but are not limited to plasma catalysis, environmental processing including treatment of liquids and gases, biological applications of plasmas including plasma medicine and agriculture, surface modification and deposition, powder and nanostructure synthesis, energy applications including plasma combustion and reforming, resource recovery, coupling of plasmas and electrochemistry, and plasma etching. Studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces are also solicited. It is essential that submissions include substantial consideration of the role of the plasma, for example, the relevant plasma chemistry, plasma physics or plasma–surface interactions; manuscripts that consider solely the properties of materials or substances processed using a plasma are not within the journal’s scope.