Impact of Interfacial Atomic Ratios on Stabilized Transport Properties in Defective Josephson Junctions

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Junling Qiu;Shuya Wang;Huihui Sun;Chuanbing Han;Yonglong Shen;Yibin Hu;Bo Zhao;Zheng Shan
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引用次数: 0

Abstract

Defects at the interfaces in the Josephson junction (JJ) are well known as a primary source of decoherence in superconducting quantum devices, indicating the necessity of elucidating defect reaction mechanisms to improve qubit performance. However, their micromechanism remains elusive. Here, we reveal the micromechanism of defects affecting the transport properties by building interfacial defective JJ device models combined with density functional theory (DFT) and nonequilibrium Green’s function (NEGF) approach. By comparing the conductance values of various interface classification models with oxygen vacancies (OVs), we find that the aluminum-rich (Al-rich) interface exhibits the smallest conductance variation, resulting in less qubit frequency fluctuations, and this can be further explained by changes in the electrostatic potential relative to the average barrier height. More importantly, the Al-rich interface demonstrates the highest stability. This work provides a theoretical basis and optimization direction for superconducting quantum chip fabrication.
界面原子比对缺陷Josephson结稳定输运性质的影响
约瑟夫森结(Josephson junction, JJ)界面上的缺陷是超导量子器件退相干的主要来源,这表明阐明缺陷反应机制以提高量子比特性能的必要性。然而,它们的微观机制仍然难以捉摸。本文结合密度泛函理论(DFT)和非平衡格林函数(NEGF)方法,建立了界面缺陷JJ器件模型,揭示了缺陷影响输运性质的微观机制。通过比较各种界面分类模型与氧空位(OVs)的电导值,我们发现富铝(Al-rich)界面的电导变化最小,导致较少的量子比特频率波动,这可以进一步解释为相对于平均势垒高度的静电势的变化。更重要的是,富al界面表现出最高的稳定性。本研究为超导量子芯片的制备提供了理论基础和优化方向。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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