InP/GaAsSb Double Heterojunction Bipolar Transistor Characterization and Compact Modeling up to 500 GHz

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Marina Deng;Chhandak Mukherjee;Lucas Réveil;Akshay M. Arabhavi;Sara Hamzeloui;Colombo R. Bolognesi;Magali De Matos;Cristell Maneux
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引用次数: 0

Abstract

This article presents a new methodology to accurately characterize indium phosphide (InP) bipolar transistors up to 500 GHz. Following design optimization of RF test structures specifically developed for the on-wafer thru-reflect-line (TRL) calibration technique, InP/GaAsSb double heterojunction bipolar transistors have been successfully characterized up to 500 GHz. Moreover, the high current model (HICUM) compact model was validated against measurements for different operating conditions and various geometries for the first time up to 500 GHz. The physics-based compact model and the associated scalable parameter extraction flow allowed us to demonstrate the scalability of this terahertz (THz) InP double heterojunction transistor (DHBT) technology, offering possibilities for further design-level explorations. State-of-the-art cut-off frequencies of this THz transistor technology featuring ${f}_{\text {MAX}}$ reaching 1 THz for transistor geometries with 0.15- $\mu \text {m}$ emitter widths were experimentally verified and confirmed by the compact model predictions.
高达500 GHz的InP/GaAsSb双异质结双极晶体管特性和紧凑建模
本文提出了一种新的方法来精确表征高达500 GHz的磷化铟(InP)双极晶体管。在对专为晶圆上透反射线(TRL)校准技术开发的射频测试结构进行设计优化后,InP/GaAsSb双异质结双极晶体管已成功地进行了高达500 GHz的表征。此外,高电流模型(HICUM)紧凑型模型首次在高达500 GHz的不同工作条件和各种几何形状下进行了验证。基于物理的紧凑模型和相关的可扩展参数提取流程使我们能够展示这种太赫兹(THz) InP双异质结晶体管(DHBT)技术的可扩展性,为进一步的设计级探索提供了可能性。对于发射极宽度为0.15- $\mu \text {m}$的晶体管几何形状,最先进的太赫兹晶体管技术的截止频率${f}_{\text {MAX}}$达到1太赫兹,实验验证并通过紧凑模型预测得到证实。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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