Compact Multilayer SIW Bandpass Filter With Cross Coupling and Source-to-Multiresonator Coupling

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Lu Qiu;Xiao-Wei Zhu;Xian-Long Yang
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Abstract

In this article, a compact high-selectivity multilayer substrate integrated waveguide (SIW) filter bound by prepreg is proposed. The filter employs two quarter-mode SIW (QMSIW) cavities in the upper layers and a full-mode SIW cavity in the lower layers. By integrating the prepreg into the cavity, the filter can be mounted directly without screws, providing better integration for high-frequency filters and preventing the introduction of spurious signals by prepreg near the passband. The utilizing of QMSIW cavities can simultaneously introduce the cross coupling and source-to-multiresonator coupling, realizing a pair of transmission zeros (TZs) in the third-order filter. Additionally, it circumvents the design limitations of non-through vias imposed by printed circuit board (PCB) layout punching requirements. The measured center frequency of the filter is 24.64 GHz, with a minimum insertion loss of 1.20 dB and a return loss better than 16.70 dB. A pair of independent controllable TZs are located at 22.27 and 27.87 GHz, respectively. The proposed filter exhibits high selectivity, compactness, improved integration, and ease of manufacturing.
具有交叉耦合和源-多腔耦合的紧凑型多层SIW带通滤波器
提出了一种基于预浸料的高选择性多层衬底集成波导(SIW)滤波器。该滤波器在上层采用两个四分之一模SIW (QMSIW)腔,在下层采用一个全模SIW腔。通过将预浸料集成到腔体中,可以直接安装滤波器,而无需螺钉,为高频滤波器提供更好的集成,并防止在通带附近通过预浸料引入杂散信号。利用QMSIW腔体可以同时引入交叉耦合和源-多腔耦合,在三阶滤波器中实现一对传输零点。此外,它规避了印刷电路板(PCB)布局冲孔要求所施加的非通孔设计限制。该滤波器的测量中心频率为24.64 GHz,最小插入损耗为1.20 dB,回波损耗优于16.70 dB。一对独立可控的tz分别位于22.27 GHz和27.87 GHz。所提出的过滤器具有高选择性,紧凑性,改进的集成度和易于制造。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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