{"title":"Compact Multilayer SIW Bandpass Filter With Cross Coupling and Source-to-Multiresonator Coupling","authors":"Lu Qiu;Xiao-Wei Zhu;Xian-Long Yang","doi":"10.1109/TCPMT.2024.3485081","DOIUrl":null,"url":null,"abstract":"In this article, a compact high-selectivity multilayer substrate integrated waveguide (SIW) filter bound by prepreg is proposed. The filter employs two quarter-mode SIW (QMSIW) cavities in the upper layers and a full-mode SIW cavity in the lower layers. By integrating the prepreg into the cavity, the filter can be mounted directly without screws, providing better integration for high-frequency filters and preventing the introduction of spurious signals by prepreg near the passband. The utilizing of QMSIW cavities can simultaneously introduce the cross coupling and source-to-multiresonator coupling, realizing a pair of transmission zeros (TZs) in the third-order filter. Additionally, it circumvents the design limitations of non-through vias imposed by printed circuit board (PCB) layout punching requirements. The measured center frequency of the filter is 24.64 GHz, with a minimum insertion loss of 1.20 dB and a return loss better than 16.70 dB. A pair of independent controllable TZs are located at 22.27 and 27.87 GHz, respectively. The proposed filter exhibits high selectivity, compactness, improved integration, and ease of manufacturing.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 12","pages":"2331-2338"},"PeriodicalIF":2.3000,"publicationDate":"2024-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10731859/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this article, a compact high-selectivity multilayer substrate integrated waveguide (SIW) filter bound by prepreg is proposed. The filter employs two quarter-mode SIW (QMSIW) cavities in the upper layers and a full-mode SIW cavity in the lower layers. By integrating the prepreg into the cavity, the filter can be mounted directly without screws, providing better integration for high-frequency filters and preventing the introduction of spurious signals by prepreg near the passband. The utilizing of QMSIW cavities can simultaneously introduce the cross coupling and source-to-multiresonator coupling, realizing a pair of transmission zeros (TZs) in the third-order filter. Additionally, it circumvents the design limitations of non-through vias imposed by printed circuit board (PCB) layout punching requirements. The measured center frequency of the filter is 24.64 GHz, with a minimum insertion loss of 1.20 dB and a return loss better than 16.70 dB. A pair of independent controllable TZs are located at 22.27 and 27.87 GHz, respectively. The proposed filter exhibits high selectivity, compactness, improved integration, and ease of manufacturing.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.