{"title":"High-Sensitivity Amorphous Boron Nitride Vacuum Ultraviolet Photodetectors","authors":"Xiaohang Liu;Tianyu Wu;Jihong Zhao;Junjie Zhu;Xi Chen;Han Yu;Yanjun Gao;Ji Zhou;Zhanguo Chen","doi":"10.1109/LED.2024.3505235","DOIUrl":null,"url":null,"abstract":"In this work, we fabricated a high-performance amorphous boron nitride vacuum ultraviolet (VUV) photodetector based on buried-electrode metal-semiconductor-metal structure for the first time. The device has a responsivity of 95.2 mA/W and an external quantum efficiency of up to 59.1% by improving carrier collection efficiency at 200 nm under a 20 V bias. At 300 K, the device exhibits a low dark current of 82 fA and a high specific detectivity of \n<inline-formula> <tex-math>$8.3 \\times 10^{\\mathbf {{13}}}$ </tex-math></inline-formula>\n Jones. The response range between 163 nm and 215 nm covers the VUV spectrum and the VUV reject ratio against 254 nm and 450 nm is \n<inline-formula> <tex-math>$4.2 \\times 10^{\\mathbf {{4}}}$ </tex-math></inline-formula>\n and \n<inline-formula> <tex-math>$7.2 \\times 10^{\\mathbf {{7}}}$ </tex-math></inline-formula>\n, respectively. Even at 500 K, the device exhibits a dark current of only 1.2 pA and high responsivity, demonstrating excellent long-term stability and reliability. Furthermore, an \n<inline-formula> <tex-math>${8} \\times {8}$ </tex-math></inline-formula>\n-pixel array composed of the photodetectors achieved stable and rapid (< 1 ms) VUV imaging. These findings demonstrate the outstanding performance of the photodetector and the potential applications of combining buried electrode structures with other ultra-wide bandgap semiconductors.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":"46 1","pages":"76-79"},"PeriodicalIF":4.1000,"publicationDate":"2024-11-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10766591/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In this work, we fabricated a high-performance amorphous boron nitride vacuum ultraviolet (VUV) photodetector based on buried-electrode metal-semiconductor-metal structure for the first time. The device has a responsivity of 95.2 mA/W and an external quantum efficiency of up to 59.1% by improving carrier collection efficiency at 200 nm under a 20 V bias. At 300 K, the device exhibits a low dark current of 82 fA and a high specific detectivity of
$8.3 \times 10^{\mathbf {{13}}}$
Jones. The response range between 163 nm and 215 nm covers the VUV spectrum and the VUV reject ratio against 254 nm and 450 nm is
$4.2 \times 10^{\mathbf {{4}}}$
and
$7.2 \times 10^{\mathbf {{7}}}$
, respectively. Even at 500 K, the device exhibits a dark current of only 1.2 pA and high responsivity, demonstrating excellent long-term stability and reliability. Furthermore, an
${8} \times {8}$
-pixel array composed of the photodetectors achieved stable and rapid (< 1 ms) VUV imaging. These findings demonstrate the outstanding performance of the photodetector and the potential applications of combining buried electrode structures with other ultra-wide bandgap semiconductors.
期刊介绍:
IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.