{"title":"Noise Coupling and Shielding Structures for Glass Core Substrate","authors":"Zhen Fang;Jihua Zhang;Jinxu Liu;Ding Wen;Libin Gao;Hongwei Chen;Xingzhou Cai;Zhihua Tao;Wanli Zhang","doi":"10.1109/LED.2024.3493599","DOIUrl":null,"url":null,"abstract":"Despite the low dielectric constant and minimal loss of glass substrates, noise coupling remains a challenge in high-frequency, high-density interconnects. In this letter, six noise shielding structures are proposed, and a simplified TGV noise coupling circuit model is developed to estimate their effectiveness. Seven test vehicles were fabricated for comparison, and good agreement was observed between the measured, simulated, and estimated results. This analysis effectively estimates noise coupling without the need for complex simulations. Noise suppression improvements of 20 dB at 40 GHz and 35 dB at 60 GHz were achieved with the guard rings, significantly outperforming traditional techniques. A 40 dB reduction in noise at 60 GHz was achieved with the guard trenches. Proposed shielding structures and evaluation methods can be applied to noise coupling in future millimeter-wave broadband glass core substrate integration.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":"46 1","pages":"84-87"},"PeriodicalIF":4.1000,"publicationDate":"2024-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10746531/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Despite the low dielectric constant and minimal loss of glass substrates, noise coupling remains a challenge in high-frequency, high-density interconnects. In this letter, six noise shielding structures are proposed, and a simplified TGV noise coupling circuit model is developed to estimate their effectiveness. Seven test vehicles were fabricated for comparison, and good agreement was observed between the measured, simulated, and estimated results. This analysis effectively estimates noise coupling without the need for complex simulations. Noise suppression improvements of 20 dB at 40 GHz and 35 dB at 60 GHz were achieved with the guard rings, significantly outperforming traditional techniques. A 40 dB reduction in noise at 60 GHz was achieved with the guard trenches. Proposed shielding structures and evaluation methods can be applied to noise coupling in future millimeter-wave broadband glass core substrate integration.
期刊介绍:
IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.