R. J. Jiang;P. Wang;J. X. Yao;X. X. Zhang;L. Cao;J. J. Li;G. Q. Sang;X. B. He;N. Zhou;Y. D. Zhang;C. C. Zhang;Z. H. Zhang;G. B. Bai;Y. H. Lu;L. L. Li;Q. K. Li;J. F. Gao;J. F. Li;Qingzhu Zhang;Huaxiang Yin;J. Luo;B. W. Dai
{"title":"High-Performance GAA FETs With 100 Ω Parasitic Resistance and 965 μA/μm On-State Current Using Quasi-Self-Aligned Landing Pads","authors":"R. J. Jiang;P. Wang;J. X. Yao;X. X. Zhang;L. Cao;J. J. Li;G. Q. Sang;X. B. He;N. Zhou;Y. D. Zhang;C. C. Zhang;Z. H. Zhang;G. B. Bai;Y. H. Lu;L. L. Li;Q. K. Li;J. F. Gao;J. F. Li;Qingzhu Zhang;Huaxiang Yin;J. Luo;B. W. Dai","doi":"10.1109/LED.2024.3505926","DOIUrl":null,"url":null,"abstract":"To overcome the challenges posed by the high parasitic resistance and poor driving performance induced by serious epitaxy defects in gate-all-around field-effect transistors (GAA FETs), a quasi-self-aligned landing pads (QSA LPs) technique is proposed, and defect-free connections among the multilayer stacked channels and single-crystal SiGe/Si superlattice source/drain (SD) structures are demonstrated in GAA FETs. When compared with devices with widely spaced LPs, reductions of 98.8% and 96.3% in the parasitic SD resistance (\n<inline-formula> <tex-math>${R}_{\\textit {SD}}$ </tex-math></inline-formula>\n) are observed for N/PFETs when using the QSA LPs technique, respectively. Therefore, the corresponding on-state current (\n<inline-formula> <tex-math>${I}_{\\textit {on}}$ </tex-math></inline-formula>\n) values are raised to \n<inline-formula> <tex-math>$965~\\mu $ </tex-math></inline-formula>\nA/\n<inline-formula> <tex-math>$\\mu $ </tex-math></inline-formula>\nm and \n<inline-formula> <tex-math>$669~\\mu $ </tex-math></inline-formula>\nA/\n<inline-formula> <tex-math>$\\mu $ </tex-math></inline-formula>\nm for 180 nm gate length N/PFETs, respectively. In addition, no significant changes are observed in the device subthreshold characteristics, including both the subthreshold swing and the on/off current ratios. The proposed scheme offers a new and promising approach to reduce the \n<inline-formula> <tex-math>${R}_{\\textit {SD}}$ </tex-math></inline-formula>\n values and enhance the performance of these advanced GAA devices.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":"46 1","pages":"4-7"},"PeriodicalIF":4.1000,"publicationDate":"2024-11-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10767246/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
To overcome the challenges posed by the high parasitic resistance and poor driving performance induced by serious epitaxy defects in gate-all-around field-effect transistors (GAA FETs), a quasi-self-aligned landing pads (QSA LPs) technique is proposed, and defect-free connections among the multilayer stacked channels and single-crystal SiGe/Si superlattice source/drain (SD) structures are demonstrated in GAA FETs. When compared with devices with widely spaced LPs, reductions of 98.8% and 96.3% in the parasitic SD resistance (
${R}_{\textit {SD}}$
) are observed for N/PFETs when using the QSA LPs technique, respectively. Therefore, the corresponding on-state current (
${I}_{\textit {on}}$
) values are raised to
$965~\mu $
A/
$\mu $
m and
$669~\mu $
A/
$\mu $
m for 180 nm gate length N/PFETs, respectively. In addition, no significant changes are observed in the device subthreshold characteristics, including both the subthreshold swing and the on/off current ratios. The proposed scheme offers a new and promising approach to reduce the
${R}_{\textit {SD}}$
values and enhance the performance of these advanced GAA devices.
期刊介绍:
IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.