Tao Chou;Tzu-Yun Liu;Li-Kai Wang;Tsai-Yu Chung;Ching-Wang Yao;Hsin-Cheng Lin;C. W. Liu
{"title":"SRAM With Oxide Semiconductor Pull-Down Transistors on the Backside Enabling Full-Node PPA Improvement","authors":"Tao Chou;Tzu-Yun Liu;Li-Kai Wang;Tsai-Yu Chung;Ching-Wang Yao;Hsin-Cheng Lin;C. W. Liu","doi":"10.1109/LED.2024.3498840","DOIUrl":null,"url":null,"abstract":"The 6T SRAM bitcell, consisting of four pFETs on the same tier and two oxide-semiconductor pull-down transistors stacked on the backside, can achieve 17% power reduction, 32% performance enhancement, and 42% area reduction as compared to one-tier SRAM bitcell. With the high strength ratio of the pass-gate transistors to the pull-down transistors, near-threshold-voltage write reduces the minimum operating voltage.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":"46 1","pages":"48-51"},"PeriodicalIF":4.1000,"publicationDate":"2024-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10753621/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The 6T SRAM bitcell, consisting of four pFETs on the same tier and two oxide-semiconductor pull-down transistors stacked on the backside, can achieve 17% power reduction, 32% performance enhancement, and 42% area reduction as compared to one-tier SRAM bitcell. With the high strength ratio of the pass-gate transistors to the pull-down transistors, near-threshold-voltage write reduces the minimum operating voltage.
期刊介绍:
IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.