Write Endurance Enhanced and Large Memory Window of GeSe-Based Selector-Only Memory With Indium Doping Scheme

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jinyu Wen;Chuanqi Yi;Jiangxi Chen;Lun Wang;Zixuan Liu;Ziqi Chen;Hao Tong;Xiangshui Miao
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Abstract

Chalcogenide-based novel Selector-Only Memory (SOM) has attracted much attention due to its fast-speed performance and manufacturability. However, the lack of endurance, caused by the polarity operation, needs to be improved. Here, we investigate an indium doping scheme for write endurance enhanced and large memory window of GeSe-based SOM. With the evidence of atomic migration, we propose a trade-off relationship between MW and endurance and a relevant model of Se-migration in a restricted range. Based on this model, we demonstrate that less than 5% In-doping can fit the optimization requirements. Besides, the performance of GeSe devices with different In concentrations further confirms the trade-off relationship. Finally, 3% In-doping GeSe SOM devices are fabricated with a large MW (1.3 V), three orders of magnitude improvement of write endurance compared with GeSe devices ( $10^{{6}}$ ) and excellent read endurance ( $10^{{9}}$ ). This work helps the endurance optimization of SOM devices and is promising to accelerate its widespread application.
铟掺杂提高geses选择器内存的写入寿命和大内存窗口
基于硫族化合物的新型选择器存储器(SOM)由于其高速性能和可制造性而受到广泛关注。但是,由于极性操作导致的续航能力不足,需要改进。在这里,我们研究了一种铟掺杂方案,以提高基于geses的SOM的写入持久性和大存储窗口。根据原子迁移的证据,我们提出了毫瓦和持久时间之间的权衡关系,以及在有限范围内硒迁移的相关模型。基于该模型,我们证明了小于5%的In-doping可以满足优化要求。此外,不同In浓度下GeSe器件的性能进一步证实了这种权衡关系。最后,制备了3%掺杂的GeSe SOM器件,该器件具有较大的MW (1.3 V),与GeSe器件相比,写入续航时间提高了3个数量级($10^{{6}}$),读取续航时间提高了10^{{9}}$)。这项工作有助于优化SOM器件的耐用性,并有望加速其广泛应用。
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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