Room‐Temperature Processable Stretchable Conductive Composite Material for Electrical Interfacing in Stretchable Printed Circuit Boards

IF 5.3 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Duho Cho, Donggoo Jang, Changju Chae, Sun Hong Kim, Taesu Kim, Su Yeon Lee, Jang‐Ung Park, Youngmin Choi, Sungmook Jung
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引用次数: 0

Abstract

This study introduces a novel Room‐Temperature Processable Stretchable Conductive Composite (RTPSC), uniquely combining room‐temperature processability, stretchability, and conductivity. Unlike traditional conductive materials requiring thermal or UV curing, which can damage heat‐sensitive components or cause substrate distortion, RTPSC uses a Styrene‐Butadiene‐Styrene (SBS) elastomer blended with silver conductive fillers and paraffin oil. This composition enables rapid solidification within five minutes at room temperature, mitigating thermal risks. Surface ligands on silver flakes are replaced with oleylamine, resulting in uniform silver distribution and enhanced resistance to acids, bases, and oxidation. The composite exhibits low contact resistance (0.1 Ω across 7.7 mm2) and maintains robust mechanical and electrical properties under extensive deformation, thanks to its high adhesion force (704.5 gF/25 mm). Notably, contact resistance change remains within 0.15 Ω even after 1800 cycles at 50% strain. RTPSC's viscosity can be finely tuned by adding solvents and secondary fluids, enabling various printing techniques from spray to omni‐directional printing. This adaptability allows intricate patterning on delicate structures via spray printing and versatile connections between stretchable electrodes and rigid components through omni‐directional printing. These capabilities provide extensive design flexibility and ease of repair, making RTPSC highly suitable for innovative development and maintenance of stretchable electronic devices.
室温可加工可拉伸导电复合材料,用于可拉伸印刷电路板的电气接口
本研究介绍了一种新型的室温可加工可拉伸导电复合材料(RTPSC),它独特地结合了室温可加工性、可拉伸性和导电性。传统的导电材料需要热固化或紫外线固化,这可能会破坏热敏元件或导致基材变形,而RTPSC使用苯乙烯-丁二烯-苯乙烯(SBS)弹性体与银导电填料和石蜡油混合。这种成分可以在室温下五分钟内快速凝固,降低热风险。银片上的表面配体被油胺取代,从而使银分布均匀,增强了对酸、碱和氧化的抵抗力。由于其高附着力(704.5 gF/25 mm),该复合材料具有低接触电阻(0.1 Ω横跨7.7 mm2),并且在大变形下保持强大的机械和电气性能。值得注意的是,接触电阻变化保持在0.15 Ω内,即使在50%应变下1800次循环后。RTPSC的粘度可以通过添加溶剂和二次流体来精细调节,从而实现从喷雾到全方位印刷的各种印刷技术。这种适应性可以通过喷射打印在精致的结构上形成复杂的图案,并通过全方位打印在可拉伸电极和刚性组件之间建立多功能连接。这些功能提供了广泛的设计灵活性和易于维修,使RTPSC非常适合可伸缩电子设备的创新开发和维护。
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来源期刊
Advanced Electronic Materials
Advanced Electronic Materials NANOSCIENCE & NANOTECHNOLOGYMATERIALS SCIE-MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
11.00
自引率
3.20%
发文量
433
期刊介绍: Advanced Electronic Materials is an interdisciplinary forum for peer-reviewed, high-quality, high-impact research in the fields of materials science, physics, and engineering of electronic and magnetic materials. It includes research on physics and physical properties of electronic and magnetic materials, spintronics, electronics, device physics and engineering, micro- and nano-electromechanical systems, and organic electronics, in addition to fundamental research.
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