Investigating the Arc-Shaped Kink Drain Voltage of Drain Current With Capacitance-Voltage Measurement Method in GaN HEMTs

IF 2.5 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jui-Tse Hsu;Shawn S. H. Hsu;Ting-Chang Chang;Chen-Hsin Lien;Ting-Tzu Kuo;Chien-Hung Yeh;Jia-Hong Lin;Ya-Huan Lee;Cheng-Hsien Lin;Wei-Chieh Hung;I-Yu Huang
{"title":"Investigating the Arc-Shaped Kink Drain Voltage of Drain Current With Capacitance-Voltage Measurement Method in GaN HEMTs","authors":"Jui-Tse Hsu;Shawn S. H. Hsu;Ting-Chang Chang;Chen-Hsin Lien;Ting-Tzu Kuo;Chien-Hung Yeh;Jia-Hong Lin;Ya-Huan Lee;Cheng-Hsien Lin;Wei-Chieh Hung;I-Yu Huang","doi":"10.1109/TDMR.2024.3467344","DOIUrl":null,"url":null,"abstract":"In this study, the measure-stress-measure (MSM) technique under the arc-shaped kink drain voltage (VD,kink) conditions is applied to investigate the \n<inline-formula> <tex-math>${\\mathrm { V}}_{\\mathrm { D,kink}}$ </tex-math></inline-formula>\n in GaN high electron mobility transistors (HEMTs). Forward and reverse transfer curves indicate that the \n<inline-formula> <tex-math>${\\mathrm { V}}_{\\mathrm { D,kink}}$ </tex-math></inline-formula>\n would change with gate voltages increasing. However, no previous study has investigated the exact location of traps that would dominate the loci of VD,kink. The results suggest that the trend of on-state current (Ion) degradation is caused by threshold voltage (Vt) shift. Hence, it can be determined that the \n<inline-formula> <tex-math>${\\mathrm { V}}_{\\mathrm { D,kink}}$ </tex-math></inline-formula>\n is related to the degree of impact ionization, which is dominant by the holes generation in the buffer. In addition, the capacitance-voltage (C-V) measurements reveal that holes generated through impact ionization at the gate edge are responsible for the shift in VD,kink. This physical mechanism is further supported by temperature-dependent analysis. Finally, the results offer a novel C-V measurement to characterize and model the physical mechanisms of the kink effect, which is governed by hot carrier degradation in GaN HEMTs.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"24 4","pages":"544-548"},"PeriodicalIF":2.5000,"publicationDate":"2024-09-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10700960/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

In this study, the measure-stress-measure (MSM) technique under the arc-shaped kink drain voltage (VD,kink) conditions is applied to investigate the ${\mathrm { V}}_{\mathrm { D,kink}}$ in GaN high electron mobility transistors (HEMTs). Forward and reverse transfer curves indicate that the ${\mathrm { V}}_{\mathrm { D,kink}}$ would change with gate voltages increasing. However, no previous study has investigated the exact location of traps that would dominate the loci of VD,kink. The results suggest that the trend of on-state current (Ion) degradation is caused by threshold voltage (Vt) shift. Hence, it can be determined that the ${\mathrm { V}}_{\mathrm { D,kink}}$ is related to the degree of impact ionization, which is dominant by the holes generation in the buffer. In addition, the capacitance-voltage (C-V) measurements reveal that holes generated through impact ionization at the gate edge are responsible for the shift in VD,kink. This physical mechanism is further supported by temperature-dependent analysis. Finally, the results offer a novel C-V measurement to characterize and model the physical mechanisms of the kink effect, which is governed by hot carrier degradation in GaN HEMTs.
用电容电压测量法研究GaN hemt中漏极电流的弧形结漏极电压
在本研究中,采用弧度弯曲漏极(VD,kink)条件下的测量-应力测量(MSM)技术研究了GaN高电子迁移率晶体管(HEMTs)中的${\ mathm {V}}_{\ mathm {D,kink}}$。正反传递曲线表明,${\ mathm {V}}_{\ mathm {D,kink}}$随栅极电压的增大而变化。然而,之前没有研究调查过控制VD、kink基因座的陷阱的确切位置。结果表明,导通电流(Ion)衰减趋势是由阈值电压(Vt)漂移引起的。由此可以确定,${\mathrm {V}}_{\mathrm {D,kink}}$与冲击电离程度有关,冲击电离程度主要由缓冲液中空穴的产生决定。此外,电容电压(C-V)测量表明,在栅极边缘通过冲击电离产生的空穴是导致VD,扭结位移的原因。这一物理机制得到了温度相关分析的进一步支持。最后,研究结果提供了一种新的C-V测量方法来表征和模拟GaN hemt中由热载子降解控制的扭结效应的物理机制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
IEEE Transactions on Device and Materials Reliability
IEEE Transactions on Device and Materials Reliability 工程技术-工程:电子与电气
CiteScore
4.80
自引率
5.00%
发文量
71
审稿时长
6-12 weeks
期刊介绍: The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信