Arne Symons;Linyan Mei;Steven Colleman;Pouya Houshmand;Sebastian Karl;Marian Verhelst
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引用次数: 0
Abstract
As the landscape of deep neural networks evolves, heterogeneous dataflow accelerators, in the form of multi-core architectures or chiplet-based designs, promise more flexibility and higher inference performance through scalability. So far, these systems exploit the increased parallelism by coarsely mapping a single layer at a time across cores, which incurs frequent costly off-chip memory accesses, or by pipelining batches of inputs, which falls short in meeting the demands of latency-critical applications. To alleviate these bottlenecks, this work explores a new fine-grain mapping paradigm, referred to as layer fusion, on heterogeneous dataflow accelerators through a novel design space exploration framework called
Stream
.
Stream
captures a wide variety of heterogeneous dataflow architectures and mapping granularities, and implements a memory and communication-aware latency and energy analysis validated with three distinct state-of-the-art hardware implementations. As such, it facilitates a holistic exploration of architecture and mapping, by strategically allocating the workload through constraint optimization. The findings demonstrate that the integration of layer fusion with heterogeneous dataflow accelerators yields up to
$2.2\times$
lower energy-delay product in inference efficiency, addressing both energy consumption and latency concerns. The framework is available open-source at: github.com/kuleuven-micas/stream.
期刊介绍:
The IEEE Transactions on Computers is a monthly publication with a wide distribution to researchers, developers, technical managers, and educators in the computer field. It publishes papers on research in areas of current interest to the readers. These areas include, but are not limited to, the following: a) computer organizations and architectures; b) operating systems, software systems, and communication protocols; c) real-time systems and embedded systems; d) digital devices, computer components, and interconnection networks; e) specification, design, prototyping, and testing methods and tools; f) performance, fault tolerance, reliability, security, and testability; g) case studies and experimental and theoretical evaluations; and h) new and important applications and trends.