A New Differential Composite Probe With Parasitic Series Loops and High Sensitivity

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Lei Wang;Sha Tang;Tao Zhang;Zhangming Zhu
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引用次数: 0

Abstract

In this work, a new differential composite probe with parasitic series loops is developed. The proposed probe consists of a U-shaped loop as the driving element, a pair of series dual loops as parasitic loops, and two striplines with two output sub-miniature-As (SMAs). First, a traditional U-shaped loop probe is utilized to test the electromagnetic fields (E and H) at the same time. Second, a pair of series dual loops as parasitic elements is inserted on both sides of the U-shaped loop to improve the detection sensitivity. The reason is that additional parasitic loops can receive more electromagnetic field components, which can increase the detection sensitivity. It is noticed that a pair of special connected via is used to connect the end of series dual loops with the middle U-shaped loop in a mirrored manner. To prevent unwanted electromagnetic modes, two rows of via fences next to these detection loops are introduced into the proposed probe. In addition, to demonstrate the unique features of the presented probe, the probe’s simulation model is simulated, fabricated, and measured based on a standard $50~\Omega $ microstrip line. Measured results reveal that the presented differential composite probe can not only test the electromagnetic fields (E and H) at the same time but also have high detection sensitivity and low profile.
一种新型高灵敏度寄生串联回路差分复合探头
本文研制了一种新型的寄生串联回路差分复合探头。该探头由一个u形环路作为驱动元件,一对串联双回路作为寄生回路,以及两条带两个输出亚微型a (sma)的带状线组成。首先,利用传统的u型环形探头同时测试电磁场(E和H)。其次,在u型环的两侧插入一对串联双回路作为寄生元件,提高检测灵敏度。原因是附加的寄生回路可以接收到更多的电磁场分量,从而可以提高检测灵敏度。需要注意的是,串联双回线的末端与中间的u型回线采用了一对特殊的连接通孔进行镜像连接。为了防止不需要的电磁模式,在这些探测回路旁边引入了两排通栅。此外,为了展示所述探头的独特功能,基于标准$50~\Omega $微带线对探头的仿真模型进行了仿真、制作和测量。实测结果表明,该差分复合探头不仅可以同时对电磁场(E和H)进行检测,而且具有较高的检测灵敏度和低姿态。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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