Embedded Silicon-Germanium-Based Thermoelectric Devices on 300-mm Wafer

IF 2.9 2区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Electron Devices Pub Date : 2024-11-12 DOI:10.1109/TED.2024.3482259

C. Schwinge;R. Hoffmann;K. Biedermann;M. Czernohorsky;J. Kannan;M. Rudolph;F. Mende;M. Wagner-Reetz;G. Gerlach;W. Weinreich

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引用次数: 0

Abstract

Scalability and the absence of moving components are excellent advantages for integrated thermoelectric (TE) devices in microelectronic applications. Both TE coolers (TECs) and TE generators (TEGs) could enhance computer chip efficiency and reliability. We show the fabrication of CMOS-compatible silicon-germanium (SiGe)-based TEC and TEG multistage structures for lateral temperature gradients with microelectronic manufacturing processes on 300-mm wafers. The smallest structures have a size of 1500

$\times $

500 nm and achieved a cooling temperature difference of around 0.13 K. The TEGs of equal dimensions reached a maximum voltage factor of 545 mV

$\cdot $

$^{-{2}} \cdot $

$^{-{1}}$

and a specific power generation factor of 2.1 nW

$\cdot $

$^{-{2}} \cdot $

$^{-{2}}$

near room temperature. Three different n-type SiGe materials were compared and examined regarding their TE properties. To address the challenge of contacting the TE element, we have captured and analyzed transmission electron microscopy (TEM) images for defect identification.

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来源期刊

IEEE Transactions on Electron Devices 工程技术-工程：电子与电气

CiteScore

5.80

自引率

16.10%

发文量

937

审稿时长

3.8 months

期刊介绍： IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.