{"title":"Compact Waveguide Filtering Power Dividers With Flexible Division Ratio and Enhanced Selectivity","authors":"Ya-Hui Zhu;Wei Qin;Jian-Xin Chen","doi":"10.1109/TCPMT.2024.3483773","DOIUrl":null,"url":null,"abstract":"This article proposes a novel design approach for multiport waveguide (WG) filtering power dividers (FPDs) with compact size and enhanced selectivity. A modified cascade trisection (CT) as a basic building block is first investigated allowing for more transmission zeros (TZs) with reduced resonators. Then, the implementation method is given and a bandpass filter (BPF) is designed, where the three poles within the passband are contributed by two rectangular WG (RWG) resonators and a half-wavelength coupling slot connecting them. The coupling slot not only acts as a resonant node but also easily provides intercavity cross-coupling. Besides, the stacked configuration combined with the input/output coaxial feeding scheme enables the enhancement of selectivity by the anticipated two TZs above the passband. An instructive design method for FPDs is proposed, in which the different power divisions mainly depend on the electric field distribution of the fundamental mode of the RWG. Finally, two three-way equal/unequal FPDs with the power division ratios of 1:1:1 and 1:2:1 are simulated, fabricated, and measured. Compared to the reported FPDs, the proposed work demonstrates good features, such as low insertion loss (IL), high selectivity, flexible division ratio, compact size, and high power-handling capability, simultaneously.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 11","pages":"2043-2049"},"PeriodicalIF":2.3000,"publicationDate":"2024-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10723811/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This article proposes a novel design approach for multiport waveguide (WG) filtering power dividers (FPDs) with compact size and enhanced selectivity. A modified cascade trisection (CT) as a basic building block is first investigated allowing for more transmission zeros (TZs) with reduced resonators. Then, the implementation method is given and a bandpass filter (BPF) is designed, where the three poles within the passband are contributed by two rectangular WG (RWG) resonators and a half-wavelength coupling slot connecting them. The coupling slot not only acts as a resonant node but also easily provides intercavity cross-coupling. Besides, the stacked configuration combined with the input/output coaxial feeding scheme enables the enhancement of selectivity by the anticipated two TZs above the passband. An instructive design method for FPDs is proposed, in which the different power divisions mainly depend on the electric field distribution of the fundamental mode of the RWG. Finally, two three-way equal/unequal FPDs with the power division ratios of 1:1:1 and 1:2:1 are simulated, fabricated, and measured. Compared to the reported FPDs, the proposed work demonstrates good features, such as low insertion loss (IL), high selectivity, flexible division ratio, compact size, and high power-handling capability, simultaneously.
期刊介绍:
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.