A Broadband Circular TE₀₁ Mode Converter Using Highly Deformed Circular Waveguide

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Zhenwei Liu;Zewei Wu;Ran Zhang;Guo Liu;Jianxun Wang;Tieyang Wang;Fangfang Song;Shuanzhu Fang;Yong Luo
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引用次数: 0

Abstract

A method for broadening the operating bandwidth of circular TE01 mode converter is proposed by using highly deformed circular waveguide (CW). The influence of deformation on the field patterns and the mode spectrum is investigated, and the maximum mode spectral gap between the TE01 mode and the undesired modes is deduced. According to the analysis, a K-band circular TE01 mode converter using highly deformed CW is designed, fabricated, and measured. The results show that conversion efficiency of a single mode converter higher than 89.1%, the reflection better than −20 dB, and the mode purity exceeds 98.7% within a relative bandwidth of 40.35%. The angle-independent transmissions demonstrating high mode purity and the appearance of TE01 mode is confirmed by the near-field pattern measurement. The mode converter features broad bandwidth, high mode purity, and compactness, which can be applied to cold-test experiments of gyro-TWT components and the high-power transmission line devices.
采用高变形圆波导的宽带圆形TE 0 1模式变换器
提出了一种利用高变形圆波导(CW)拓宽TE01圆模变换器工作带宽的方法。研究了变形对场模式和模态谱的影响,推导出了TE01模态与非期望模态之间的最大模态谱差。在此基础上,设计、制作并测量了一种基于高变形连续波的k波段圆形TE01模式变换器。结果表明,单模变换器的转换效率高于89.1%,反射率优于−20 dB,在40.35%的相对带宽内,模式纯度超过98.7%。近场模态测量证实了该非角传输具有较高的模态纯度和TE01模态的出现。该变换器具有带宽宽、模式纯度高、结构紧凑等特点,可用于陀螺行波管器件和大功率传输线器件的冷试实验。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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