Silicon Nanomembrane Based Flexible Temperature-Bending Strain Dual-Mode Sensor Decoupled by Fast Fourier Transform

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Deyu Meng;Haonan Zhao;Xiaozhong Wu;Min Liu;Qinglei Guo
{"title":"Silicon Nanomembrane Based Flexible Temperature-Bending Strain Dual-Mode Sensor Decoupled by Fast Fourier Transform","authors":"Deyu Meng;Haonan Zhao;Xiaozhong Wu;Min Liu;Qinglei Guo","doi":"10.1109/LED.2024.3481255","DOIUrl":null,"url":null,"abstract":"Flexible dual-mode sensors that are capable of simultaneously sensing temperature and strain exhibit huge prospects in applications such as health monitoring, human-computer interaction, and intelligent robots. However, decoupling different stimuli accurately still faces severe challenges. In this study, we present a silicon based flexible dual-mode sensor that can be seamlessly attached to human body, enabling precise and real-time acquisition of physiological temperature and strain signals. The fabricated device only contains one sensing unit, with good sensing performances to both temperature and bending strain, including good linearity, high sensitivity, low hysteresis, and long-term stability. In various application scenarios, the fabricated dual-mode sensor can be utilized to monitor respiration, pulse, and body temperature. Moreover, due to different specific response times to temperature and strain, pulse and temperature signals obtained from the wrist can be successfully decoupled through the fast Fourier transform (FFT) and inverse FFT. These presented results offer significant potentials for the development of skin-inspired electronics with simple device structures and multifunctional capabilities.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":"45 12","pages":"2518-2521"},"PeriodicalIF":4.1000,"publicationDate":"2024-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10718338/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

Flexible dual-mode sensors that are capable of simultaneously sensing temperature and strain exhibit huge prospects in applications such as health monitoring, human-computer interaction, and intelligent robots. However, decoupling different stimuli accurately still faces severe challenges. In this study, we present a silicon based flexible dual-mode sensor that can be seamlessly attached to human body, enabling precise and real-time acquisition of physiological temperature and strain signals. The fabricated device only contains one sensing unit, with good sensing performances to both temperature and bending strain, including good linearity, high sensitivity, low hysteresis, and long-term stability. In various application scenarios, the fabricated dual-mode sensor can be utilized to monitor respiration, pulse, and body temperature. Moreover, due to different specific response times to temperature and strain, pulse and temperature signals obtained from the wrist can be successfully decoupled through the fast Fourier transform (FFT) and inverse FFT. These presented results offer significant potentials for the development of skin-inspired electronics with simple device structures and multifunctional capabilities.
基于快速傅里叶变换解耦的硅纳米膜柔性温度弯曲应变双模传感器
能够同时感知温度和应变的柔性双模传感器在健康监测、人机交互、智能机器人等领域具有广阔的应用前景。然而,准确解耦不同的刺激仍然面临严峻的挑战。在这项研究中,我们提出了一种基于硅的柔性双模传感器,可以无缝地附着在人体上,能够精确实时地获取生理温度和应变信号。该器件仅包含一个传感单元,对温度和弯曲应变均具有良好的传感性能,包括良好的线性度、高灵敏度、低迟滞和长期稳定性。在各种应用场景中,所制备的双模传感器可用于监测呼吸、脉搏和体温。此外,由于对温度和应变的特定响应时间不同,从手腕获得的脉冲和温度信号可以通过快速傅里叶变换(FFT)和反FFT成功解耦。这些结果为具有简单设备结构和多功能功能的皮肤启发电子产品的发展提供了巨大的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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