Simultaneous Calibration of Axial and Lateral Radiation Forces of Ultra-High Frequency Ultrasound Acting on a Microrobot With Arbitrary Geometry

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jinzhe Wu;Jialin Shi;Zhaoxi Li;Peng Yu;Huiyao Shi;Si Tang;Shanshan Chen;Chunlong Fei;Chanmin Su;Lianqing Liu
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引用次数: 0

Abstract

Acoustically actuated microrobots have attracted considerable attention, which have developed various geometries. These microrobots are powered through their interaction with acoustics. The use of ultrahigh-frequency (UHF) ultrasound yields a focus on the order of several microns, thus actuating microrobots with accurate, strong, and two-directional forces. However, to date no technique can simultaneously calibrate the actual axial and lateral radiation forces of UHF ultrasound above 60 MHz acting on a microrobot with arbitrary geometry. To address this issue, we present a force sensor based on a micropipette. The force sensor consists of the micropipette, microrobot with a marker, and fixed base, which calibrates the overall spring constants. By combining the two-directional displacements actuated by the axial and lateral radiation forces, we calibrated the forces with a resolution of hundreds of piconewtons. We calibrated the axial and lateral radiation forces on cylindrical and spherical microrobots with the same volume and further investigated the influences of the duty factor and excitation voltage. This method complements a crucial design link in UHF ultrasound actuating microrobots.
超高频超声作用于任意几何形状微型机器人的轴向和侧向辐射力的同步标定
声学驱动的微型机器人已经引起了人们的广泛关注,它们已经发展出各种各样的几何形状。这些微型机器人通过与声学的相互作用来提供动力。超高频(UHF)超声波的使用产生了几微米量级的焦点,从而以精确、强大和双向的力驱动微型机器人。然而,到目前为止,还没有一种技术可以同时校准60 MHz以上的超高频超声波作用于任意几何形状的微型机器人的实际轴向和横向辐射力。为了解决这个问题,我们提出了一种基于微移液管的力传感器。力传感器由微移液器、带标记的微型机器人和固定底座组成,用于校准整体弹簧常数。通过结合由轴向和横向辐射力驱动的双向位移,我们以数百皮牛顿的分辨率校准了力。标定了相同体积圆柱形和球形微型机器人的轴向和侧向辐射力,并进一步研究了占空因子和激励电压的影响。该方法补充了超高频超声驱动微型机器人设计的关键环节。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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