{"title":"Comparative analysis of capacitorless DRAM performance according to stacked junctionless gate-all-around structures","authors":"Jihye Hwang, Ilgu Yun","doi":"10.1016/j.sse.2024.109036","DOIUrl":null,"url":null,"abstract":"<div><div>The characteristic comparison of the capacitor-less DRAMs in the structural form variation is investigated. Based on the simulation results of the three basic structures, such as circular, square, and rectangular nanosheets, the gate length (L<sub>g</sub>), channel thickness (T<sub>si</sub>), and width of the nanosheet (W<sub>si</sub>) are considered as the main factors in design and the characteristic variations are verified according to the junctionless (JL) gate-all-around (GAA) geometry factors. The channel thickness is a major factor that has a major influence on the sensing margin and the retention time, which are important characteristics of DRAM. The thinner the thickness, the more deteriorated the sensing margin is confirmed. Retention time is due to the influence of the electric field distribution of the JL GAA structure, resulting in differences in structure. Finally, the rectangular type nanosheet is implemented in the stacked structure. As the number of stacks increases, the effective channel width increases compared to the layout footprint. In addition, by stacking vertically, the area where holes can be stored increases. Therefore, the sensing margin tends to increase as the number of stacks increases. However, the difference in diffusion due to the difference in the initially stored hole density, the retention time deteriorates as the number of stacks increases.</div></div>","PeriodicalId":21909,"journal":{"name":"Solid-state Electronics","volume":"223 ","pages":"Article 109036"},"PeriodicalIF":1.4000,"publicationDate":"2024-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Solid-state Electronics","FirstCategoryId":"101","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0038110124001850","RegionNum":4,"RegionCategory":"物理与天体物理","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The characteristic comparison of the capacitor-less DRAMs in the structural form variation is investigated. Based on the simulation results of the three basic structures, such as circular, square, and rectangular nanosheets, the gate length (Lg), channel thickness (Tsi), and width of the nanosheet (Wsi) are considered as the main factors in design and the characteristic variations are verified according to the junctionless (JL) gate-all-around (GAA) geometry factors. The channel thickness is a major factor that has a major influence on the sensing margin and the retention time, which are important characteristics of DRAM. The thinner the thickness, the more deteriorated the sensing margin is confirmed. Retention time is due to the influence of the electric field distribution of the JL GAA structure, resulting in differences in structure. Finally, the rectangular type nanosheet is implemented in the stacked structure. As the number of stacks increases, the effective channel width increases compared to the layout footprint. In addition, by stacking vertically, the area where holes can be stored increases. Therefore, the sensing margin tends to increase as the number of stacks increases. However, the difference in diffusion due to the difference in the initially stored hole density, the retention time deteriorates as the number of stacks increases.
期刊介绍:
It is the aim of this journal to bring together in one publication outstanding papers reporting new and original work in the following areas: (1) applications of solid-state physics and technology to electronics and optoelectronics, including theory and device design; (2) optical, electrical, morphological characterization techniques and parameter extraction of devices; (3) fabrication of semiconductor devices, and also device-related materials growth, measurement and evaluation; (4) the physics and modeling of submicron and nanoscale microelectronic and optoelectronic devices, including processing, measurement, and performance evaluation; (5) applications of numerical methods to the modeling and simulation of solid-state devices and processes; and (6) nanoscale electronic and optoelectronic devices, photovoltaics, sensors, and MEMS based on semiconductor and alternative electronic materials; (7) synthesis and electrooptical properties of materials for novel devices.