Growth instability of N-polar GaN on vicinal SiC substrate using plasma-assisted molecular beam epitaxy

IF 2 4区 材料科学 Q3 MATERIALS SCIENCE, COATINGS & FILMS
Lili Huo , R. Lingaparthi , N. Dharmarasu , K. Radhakrishnan
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Abstract

The growth instabilities of N-polar GaN on vicinal SiC substrates with an offcut angle of 4° towards the m-plane using plasma-assisted molecular beam epitaxy (PA-MBE) were systematically studied. The morphology with the coexistence of step bunching and step meandering was demonstrated experimentally for N-polar GaN grown on vicinal SiC substrates. The morphology evolution of N-polar GaN as a function of time reveals that the step bunching instability occurred first in the initial stage, followed by the step meandering. The step bunching instability is attributed to the negative Ehrlich-Schwoebel barrier (ESB), which dominates the initial growth. On the other hand, step meandering is explained by the higher positive ESB along the edges of macrosteps. Additionally, step meandering of N-polar GaN was enhanced for samples grown with lower Ga flux, while step bunching was found to be alleviated. On the other hand, its Ga-polar counterpart only demonstrated step bunching features. In addition, N-polar GaN grown on vicinal SiC under optimal conditions still exhibited a much rougher surface than the N-polar GaN grown on on-axis substrates. These results indicate that PA-MBE grown N-polar GaN surface may not be improved by using vicinal SiC substrates when compared with that grown on on-axis SiC substrates.
利用等离子体辅助分子束外延技术在邻位碳化硅衬底上实现 N 极 GaN 的不稳定生长
利用等离子体辅助分子束外延(PA-MBE)技术,系统地研究了氮化镓(N-polar GaN)在沧桑SiC衬底上的生长不稳定性,该衬底与m平面的偏切角为4°。实验证明,在沧桑SiC衬底上生长的N极GaN具有阶跃束化和阶跃蜿蜒并存的形貌。N 极氮化镓的形貌演变与时间的函数关系表明,阶跃束化不稳定性首先发生在初始阶段,其次是阶跃蜿蜒。阶跃束化不稳定性归因于负的 Ehrlich-Schwoebel 势垒 (ESB),它在初始生长阶段占主导地位。而阶梯蜿蜒则是由于大阶梯边缘较高的正 ESB 所致。此外,在镓通量较低的情况下生长的样品,N 极氮化镓的阶跃蜿蜒性会增强,而阶跃束集现象则会减轻。另一方面,其 Ga 极对应物仅表现出阶跃束集特征。此外,在最佳条件下,在沧桑SiC上生长的N极GaN仍然比在轴向衬底上生长的N极GaN表面粗糙得多。这些结果表明,与在轴向碳化硅衬底上生长的氮极 GaN 相比,使用邻接碳化硅衬底生长的 PA-MBE 氮极 GaN 表面可能不会得到改善。
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来源期刊
Thin Solid Films
Thin Solid Films 工程技术-材料科学:膜
CiteScore
4.00
自引率
4.80%
发文量
381
审稿时长
7.5 months
期刊介绍: Thin Solid Films is an international journal which serves scientists and engineers working in the fields of thin-film synthesis, characterization, and applications. The field of thin films, which can be defined as the confluence of materials science, surface science, and applied physics, has become an identifiable unified discipline of scientific endeavor.
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