Effect of combined treatment of laser shock peening and shot peening on fatigue performance of laser-powder-bed-fusioned GH4169 nickel-based alloy

IF 4.6 2区 物理与天体物理 Q1 OPTICS
Peixuan Ouyang , Zhichao Dong , Xuekun Luo , Shuting Zhang , Lu Liu , Bin Sun , Lijie Zhou
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引用次数: 0

Abstract

The laser-powder-bed-fusioned (LPBFed) GH4169 nickel-based alloys were respectively surface-strengthened by laser shock peening (LSP), shot peening (SP), and a combination of LSP and SP (LSP + SP). The surface roughness, microhardness, residual stress, and microstructures of the un-peened, (LSP + SP)ed, LSPed, and SPed sample were comparatively studied. The fatigue gain mechanism of the LSP + SP combined treatment on the LPBFed alloy was finally revealed. The vibration fatigue life of the (LSP + SP)ed sample under 680 MPa is at least 37.76 times, 1.58 times, and 0.79 times longer compared with the un-peened LSPed and SPed samples. The LSP + SP treatment decreased the stress concentration coefficient Kt compared with LSP treatment. The maximum compressive residual stress (CRS) of the (LSP + SP)ed sample is 68 % larger than that of the LSPed sample, and the CRS layer thickness is 1.12 times thicker compared with the SPed sample. The average grain size for the (LSP + SP)ed sample is the smallest, and the LAGBs fraction increases by 96 % and 50.9 % compared with the LSPed and SPed samples. The fatigue gain mechanism of the LSP + SP combined treatment on the LPBFed alloy is concluded that the largest maximum CRS, a thick CRS layer, the refined grains, and the decreased Kt extend the crack initiation life, and the smallest grain size, the highest density of dislocation substructures, as well as the highest fraction of LAGBs extend the crack propagation life. The results demonstrated that the LSP + SP combined treatment is an efficient surface strengthening method that can improve fatigue life of LPBFed nickel-based alloys.
激光冲击强化和喷丸强化联合处理对激光粉末床熔融 GH4169 镍基合金疲劳性能的影响
分别通过激光冲击强化(LSP)、喷丸强化(SP)以及 LSP 和 SP 组合(LSP + SP)对激光粉末床熔化(LPBFed)GH4169 镍基合金进行了表面强化。比较研究了未强化、(LSP + SP)强化、LSP强化和SP强化样品的表面粗糙度、显微硬度、残余应力和显微组织。最终揭示了 LSP + SP 组合处理对 LPBFed 合金的疲劳增益机理。在 680 兆帕下,经过(LSP + SP)处理的样品的振动疲劳寿命比未经强化处理的 LSPed 和 SPed 样品至少延长了 37.76 倍、1.58 倍和 0.79 倍。与 LSP 处理相比,LSP + SP 处理降低了应力集中系数 Kt。经(LSP + SP)处理的样品的最大压缩残余应力(CRS)比经 LSP 处理的样品大 68%,CRS 层厚度是经 SP 处理样品的 1.12 倍。(LSP + SP)ed 样品的平均晶粒尺寸最小,与 LSPed 和 SPed 样品相比,LAGBs 分数分别增加了 96% 和 50.9%。LSP+SP组合处理对LPBFed合金的疲劳增益机理的结论是:最大的CRS、厚的CRS层、细化的晶粒和降低的Kt延长了裂纹起始寿命,而最小的晶粒尺寸、最高密度的位错子结构以及最高比例的LAGBs延长了裂纹扩展寿命。结果表明,LSP + SP 组合处理是一种高效的表面强化方法,可提高 LPBFed 镍基合金的疲劳寿命。
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来源期刊
CiteScore
8.50
自引率
10.00%
发文量
1060
审稿时长
3.4 months
期刊介绍: Optics & Laser Technology aims to provide a vehicle for the publication of a broad range of high quality research and review papers in those fields of scientific and engineering research appertaining to the development and application of the technology of optics and lasers. Papers describing original work in these areas are submitted to rigorous refereeing prior to acceptance for publication. The scope of Optics & Laser Technology encompasses, but is not restricted to, the following areas: •development in all types of lasers •developments in optoelectronic devices and photonics •developments in new photonics and optical concepts •developments in conventional optics, optical instruments and components •techniques of optical metrology, including interferometry and optical fibre sensors •LIDAR and other non-contact optical measurement techniques, including optical methods in heat and fluid flow •applications of lasers to materials processing, optical NDT display (including holography) and optical communication •research and development in the field of laser safety including studies of hazards resulting from the applications of lasers (laser safety, hazards of laser fume) •developments in optical computing and optical information processing •developments in new optical materials •developments in new optical characterization methods and techniques •developments in quantum optics •developments in light assisted micro and nanofabrication methods and techniques •developments in nanophotonics and biophotonics •developments in imaging processing and systems
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