A novel method used to prepare PN junction by plasmon generated under pulsed laser irradiation on silicon chip

IF 1.4 4区 物理与天体物理 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Wei-Qi Huang , Yin-Lian Li , Zhong-Mei Huang , Hao-Ze Wang , Shi-Rong Liu
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引用次数: 0

Abstract

We prepare the PN junction on silicon chip by a novel method with surface plasmon generated under pulsed laser irradiation. It is found that the interaction between laser photons and plasma produces a plasmon layer, in which the faster electrons take resonance with photons to generate surface electron gas. It is interesting that the electron gas in high vacuum and the plasmon polarized in various atmosphere are directly observed by the Talbot reflect image with outstanding challenge. It is demonstrated that injection and diffusion can be completed quickly to form higher quality PN region on interface between ions layer and substrate while the plasmon dipole makes resonance with phonon, where the quantum energy of plasmon is closed to the phonon energy in silicon crystal. In this novel way, the PN junction structure can be built by coherent photons on silicon chip at first, and the different preparing processes are explored comparatively by using the I-V curves measured with nonlinear characteristic of PN junction for application in optic-electronic integration field.
利用脉冲激光照射硅芯片产生的等离子体制备 PN 结的新方法
我们采用一种在脉冲激光照射下产生表面等离子体的新方法,在硅芯片上制备了 PN 结。研究发现,激光光子和等离子体之间的相互作用产生了等离子体层,其中速度较快的电子与光子发生共振,从而产生表面电子气。有趣的是,塔尔博特反射图像可以直接观测到高真空中的电子气和各种大气中的等离子体极化,具有很高的挑战性。实验证明,注入和扩散可以快速完成,从而在离子层和衬底之间的界面上形成更高质量的 PN 区域,同时等离子体偶极子与声子产生共振,而等离子体的量子能与硅晶体中的声子能接近。通过这种新颖的方法,相干光子可以在硅芯片上首先构建 PN 结结构,并利用测量到的 PN 结非线性特性的 I-V 曲线比较探讨了不同的制备过程,从而将其应用于光电子集成领域。
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来源期刊
Solid-state Electronics
Solid-state Electronics 物理-工程:电子与电气
CiteScore
3.00
自引率
5.90%
发文量
212
审稿时长
3 months
期刊介绍: It is the aim of this journal to bring together in one publication outstanding papers reporting new and original work in the following areas: (1) applications of solid-state physics and technology to electronics and optoelectronics, including theory and device design; (2) optical, electrical, morphological characterization techniques and parameter extraction of devices; (3) fabrication of semiconductor devices, and also device-related materials growth, measurement and evaluation; (4) the physics and modeling of submicron and nanoscale microelectronic and optoelectronic devices, including processing, measurement, and performance evaluation; (5) applications of numerical methods to the modeling and simulation of solid-state devices and processes; and (6) nanoscale electronic and optoelectronic devices, photovoltaics, sensors, and MEMS based on semiconductor and alternative electronic materials; (7) synthesis and electrooptical properties of materials for novel devices.
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