Preface to a Special Issue E-MRS 2023 Fall Meeting, Symposium A, Integration of advanced materials on silicon, from classical to neuromorphic and quantum applications

IF 2 4区材料科学 Q3 MATERIALS SCIENCE, COATINGS & FILMS

Thin Solid Films Pub Date : 2024-10-30 DOI:10.1016/j.tsf.2024.140539

Abderraouf Boucherif , Andriy Hikavyy , Jacopo Frigerio , Katarzyna Hnida-Gut

引用次数: 0

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特刊序言 E-MRS 2023 秋季会议，专题讨论会 A，硅上先进材料的集成，从经典到神经形态和量子应用

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Thin Solid Films 工程技术-材料科学：膜

CiteScore

4.00

自引率

4.80%

发文量

381

审稿时长

7.5 months

期刊介绍： Thin Solid Films is an international journal which serves scientists and engineers working in the fields of thin-film synthesis, characterization, and applications. The field of thin films, which can be defined as the confluence of materials science, surface science, and applied physics, has become an identifiable unified discipline of scientific endeavor.