Zonglin Wu;Shuxian Wu;Hangyu Qian;Feihong Bao;Gongbin Tang;Guo-Min Yang;Jie Zou
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引用次数: 0
Abstract
This study introduces shear horizontal (SH) surface acoustic wave (SAW) resonators based on a multilayered structure of lithium tantalate (LiTaO3 or LT)/silicon dioxide (SiO2)/4H-silicon carbide (4H SiC). SiC exhibits high resistivity (HR) (
$\rho \gt 10^{{10}}~\Omega \cdot $
cm), effectively suppressing the parasitic surface conduction (PSC) effect. The suppression of the PSC effect by 4H-SiC substrates is demonstrated by extracting the substrate loss of SiO2/4H-SiC and SiO2/Si substrates in a coplanar waveguide (CPW) structure. Consequently, SAW resonators based on 4H-SiC substrates demonstrate a superior quality factor (Q) compared to the conventional SH SAW resonators based on Si substrates. The fabricated resonators with 4H-SiC and Si substrates achieved Bode-
${Q} _{\max }$
of 3916 and 1836,
${Q} _{\text {p}}$
of 3402 and 590, and admittance ratios (
${Y} _{\text {r}}$
) of 92 and 74 dB, respectively. The
${Q} _{\text {p}}$
of the 4H-SiC-based resonator is 5.7 times higher than that of the Si-based resonator. Substituting the Si substrate with the 4H-SiC substrate increases Q without compromising the effective electromechanical coupling (
${k} ^{{2}}_{\text {eff}}$
) and temperature coefficient of frequency (TCF). To suppress the transverse mode of the SAW resonators, tilted interdigital transducers (IDTs) at various titled angles were fabricated. A 12° tilt angle IDT demonstrated the most effective transverse mode suppression. When the tilted IDT was employed, the
${Q} _{\text {p}}$
of the SAW resonator based on the 4H-SiC substrate surpassed that of Si substrate. Compared to the Si substrate, the 4H-SiC substrate resulted in a higher
${Q} _{\text {p}}$
, making this technique promising for application in filters, oscillators, and sensors.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.