{"title":"The variation in Anand model parameters – How does that affect the bond's response? A comparative study considering sintered Ag bonds","authors":"","doi":"10.1016/j.microrel.2024.115528","DOIUrl":null,"url":null,"abstract":"<div><div>Finite element analysis (FEA) is a widely used technique for simulating the thermally induced mechanical behavior of die bonding materials in electronics. The Anand unified viscoplasticity model is commonly employed to simulate the mechanical responses of such interconnections. This model comprises nine parameters, the individual effects of which are not fully understood in the literature. This paper aims to investigate the impact of each Anand parameter on the mechanical response of sintered silver (Ag) bonds through extensive finite element simulations. Various Anand models for sintered Ag, sourced from literature, are utilized to create a systematic study matrix for each parameter. These material coefficients are then incorporated into thermal and thermomechanical simulations to induce inelastic deformations in the sintered Ag bonds. The bonding layer response is analyzed in terms of stress-strain relationships, inelastic strains, and inelastic strain energy density. The results indicated that certain Anand parameters could cause the bond response to shift towards brittle behavior, while others could result in a more ductile behavior. Using statistical factorial analysis, it is found that the significance of each parameter varied greatly, from negligible to highly significant. The findings of this study are valuable for understanding the behavior of various bonds configurations and their expected thermal fatigue performance based on their Anand creep constants. Additionally, this paper lays the groundwork for understanding the meaning of Anand constants and their influence on the mechanical response of any bond material which is not discussed in literature yet.</div></div>","PeriodicalId":51131,"journal":{"name":"Microelectronics Reliability","volume":null,"pages":null},"PeriodicalIF":1.6000,"publicationDate":"2024-10-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Reliability","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0026271424002087","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Finite element analysis (FEA) is a widely used technique for simulating the thermally induced mechanical behavior of die bonding materials in electronics. The Anand unified viscoplasticity model is commonly employed to simulate the mechanical responses of such interconnections. This model comprises nine parameters, the individual effects of which are not fully understood in the literature. This paper aims to investigate the impact of each Anand parameter on the mechanical response of sintered silver (Ag) bonds through extensive finite element simulations. Various Anand models for sintered Ag, sourced from literature, are utilized to create a systematic study matrix for each parameter. These material coefficients are then incorporated into thermal and thermomechanical simulations to induce inelastic deformations in the sintered Ag bonds. The bonding layer response is analyzed in terms of stress-strain relationships, inelastic strains, and inelastic strain energy density. The results indicated that certain Anand parameters could cause the bond response to shift towards brittle behavior, while others could result in a more ductile behavior. Using statistical factorial analysis, it is found that the significance of each parameter varied greatly, from negligible to highly significant. The findings of this study are valuable for understanding the behavior of various bonds configurations and their expected thermal fatigue performance based on their Anand creep constants. Additionally, this paper lays the groundwork for understanding the meaning of Anand constants and their influence on the mechanical response of any bond material which is not discussed in literature yet.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.