Research on Gate Charge Degradation of Multi-Chip IGBT Modules in Power Supply for Unmanned Aerial Vehicles

Abstract

In recent years, with the burgeoning application of high voltage in various industrial sectors, the deployment of unmanned equipment, such as industrial heavy-load Unmanned Aerial Vehicles (UAVs), incorporating high-capacity Insulated-Gate Bipolar Transistors (IGBTs), has become increasingly prevalent. The demand for high-voltage IGBT modules in UAV is continuously growing; therefore, exploring methods to predict fault precursor parameters of multi-chip IGBT modules is crucial for the operational health management of unmanned equipment like UAVs. This paper analyzes the gate charge degradation in multi-chip IGBT modules after thermal cycling, which can be used to evaluate the operational state of these modules. Furthermore, to delve into the electrical response of a gate drive circuit caused by local damage within the IGBT module, an RLC model incorporating parasitic parameters of the gate drive circuit is established, and a sensitivity analysis of the peak current in the gate charge circuit is provided. Additionally, in the experimental circuit, an open sample of an IGBT module with partial bond wires lifted off is used to simulate actual faults. The analysis and experimental results indicate that the peak current of the gate charge is closely related to L and C. The significant deviation in the gate current, influenced by the partial bond wires lift-off, can provide a basis for the development of predictive methods for IGBT modules.