Robustness of Large-Size Vacuum Sealed Packages for Microbolometer Array

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Hexin Xia;Hoang-Vu Nguyen;Avisek Roy;Per Ohlckers;Knut Eilif Aasmundtveit
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引用次数: 0

Abstract

Microbolometers are the core detectors of uncooled thermal sensors. These detectors require a high vacuum environment (<1> $\sim 12\times 12$ mm) wafer-level Cu-Sn SLID packages using a time-dependent cap deflection study and exposing them to humidity and thermal shock test environments. Cap deflection measurements at the wafer level indicate that the dies maintained a stable vacuum for more than 13 months after bonding before they were exposed to harsh environments. The Cu-Sn SLID packages display resilience to corrosion effects, with 93% of the dies passing the humidity test. In contrast, all dies failed the thermal shock test due to vertical cracks in the Cu/Cu3Sn/Cu bondline. These vertical cracks are primarily found to propagate through voids in the Cu3Sn, where the stresses are assumed to be the largest. To mitigate vertical crack formation and enhance long-term sealing frame integrity, void formation must be minimized. Strict requirements are thus put on the electroplating process to avoid contamination, demanding careful monitoring of the bath conditions and optimization of the electroplating parameters.
用于微测辐射热计阵列的大型真空密封封装的稳健性
微测辐射热计是非制冷热传感器的核心探测器。这些探测器需要在高真空环境(12 毫米)下使用晶圆级铜-锰 SLID 封装,使用随时间变化的电容偏转研究,并将其暴露在湿度和热冲击测试环境中。晶圆级瓶盖挠度测量结果表明,芯片在接合后保持稳定真空状态的时间超过 13 个月,然后才暴露在恶劣的环境中。铜-锰 SLID 封装显示出对腐蚀影响的适应能力,93% 的芯片通过了湿度测试。相反,由于 Cu/Cu3Sn/Cu 键合线出现垂直裂纹,所有模具都未能通过热冲击测试。这些垂直裂纹主要是通过 Cu3Sn 的空隙传播的,而此处的应力被认为是最大的。为了减少垂直裂纹的形成并提高密封框架的长期完整性,必须尽量减少空隙的形成。因此,对电镀工艺提出了严格的要求,以避免污染,这就要求对电镀槽条件进行仔细监控,并优化电镀参数。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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