Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate

IF 1.7 4区 材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Jiacheng Zhou, Jinglin Shi, Lei Xu, Fuwen Zhang, Zhigang Wang, Qiang Hu, Huijun He
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Abstract

Purpose

The reliability of solder joints is closely related to the growth of an intermetallic compound (IMC) layer between the lead-free solder and substrate interface. This paper aims to investigate the growth behavior of the interfacial IMC layer during isothermal aging at 125°C for Sn-3Ag-3Sb-xIn/Cu (x = 0, 1, 2, 3, 4, 5 Wt.%) solder joints with different In contents and commercial Sn-3Ag-0.5Cu/Cu solder joints.

Design/methodology/approach

In this paper, Sn-3Ag-3Sb-xIn/Cu (x = 0, 1, 2, 3, 4, 5 Wt.%) and commercial Sn-3Ag-0.5Cu/Cu solder were prepared for bonding Cu substrate. Then these samples were subjected to isothermal aging for 0, 2, 8, 14, 25 and 45 days. Scanning electron microscopy and transmission electron microscopy were used to analyze the soldering interface reaction and the difference in IMC growth behavior during the isothermal aging process.

Findings

When the concentration of In in the Sn-3Ag-3Sb-xIn/Cu solder joints exceeded 2 Wt.%, a substantial amount of InSb particles were produced. These particles acted as a diffusion barrier, impeding the growth of the IMC layer at the interface. The growth of the Cu3Sn layer during the aging process was strongly correlated with the presence of In. The growth rate of the Cu3Sn layer was significantly reduced when the In concentration exceeded 3 Wt.%.

Originality/value

The addition of In promotes the formation of InSb particles in Sn-3Ag-3Sb-xIn/Cu solder joints. These particles limit the growth of the total IMC layer, while a higher In content also slows the growth of the Cu3Sn layer. This study is significant for designing alloy compositions for new high-reliability solders.

铜基板上锡-3Ag-3Sb-xIn 焊料的界面 IMC 生长行为
目的 焊点的可靠性与无铅焊料和基底界面之间金属间化合物(IMC)层的生长密切相关。本文旨在研究不同铟含量的锡-3Ag-3Sb-xIn/Cu(x = 0、1、2、3、4、5 Wt.%)焊点和商用锡-3Ag-0.5Cu/Cu 焊点在 125°C 等温老化过程中界面 IMC 层的生长行为。本文制备了锡-3Ag-3Sb-xIn/Cu(x = 0、1、2、3、4、5 Wt.%)和商用锡-3Ag-0.5Cu/Cu 焊料,用于接合铜基板。然后对这些样品进行 0、2、8、14、25 和 45 天的等温老化。研究结果当锡-3Ag-3Sb-xIn/铜焊点中的 In 浓度超过 2 Wt.%时,会产生大量的 InSb 颗粒。这些颗粒起到了扩散屏障的作用,阻碍了界面上 IMC 层的生长。老化过程中 Cu3Sn 层的生长与 In 的存在密切相关。当 In 的浓度超过 3 Wt.% 时,Cu3Sn 层的生长速度明显降低。这些颗粒限制了整个 IMC 层的生长,而较高的 In 含量也会减缓 Cu3Sn 层的生长。这项研究对于设计新型高可靠性焊料的合金成分具有重要意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 工程技术-材料科学:综合
CiteScore
4.10
自引率
15.00%
发文量
30
审稿时长
>12 weeks
期刊介绍: Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.
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