A Highly Stretchable Circuit Based on Metal-Elastomer Composite

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Fankai Kong;Hu Tang;Peng Liu;Xiao Liu;Jiwei Zhao;Junjian Li;Jue Peng
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引用次数: 0

Abstract

We develop a highly stretchable circuit by utilizing serpentine interconnects made of high-elasticity Cu-Be alloy. An elastic equivalent model of serpentine interconnect is used to optimize the geometric parameters, thereby enhancing its mechanical compatibility with the soft substrate. Furthermore, we propose a rapid fabrication method of highly stretchable circuits through the laser cutting and film transfer techniques. The results indicate that the elastic strain limit of the Cu-Be alloy serpentine interconnect is 4 times that of the Cu interconnect. The Cu-Be alloy serpentine circuit with optimized geometric parameters exhibits an excellent resistance stability under 1000 cycles of tensile testing at 90% strain without local delamination or failure. The light emitting diode (LED) array demonstrates an ultrahigh tensile strain limit of up to 200%. The proposed method can provide a novel and promising way for the fabrication of highly stretchable circuits for future wearable electronic devices.
基于金属弹性体复合材料的高拉伸电路
我们利用由高弹性铜铍合金制成的蛇形互连器件,开发出了一种高度可拉伸的电路。我们利用蛇形互连的弹性等效模型来优化几何参数,从而提高其与软基板的机械兼容性。此外,我们还提出了一种通过激光切割和薄膜转移技术快速制造高拉伸电路的方法。结果表明,铜铍合金蛇形互连的弹性应变极限是铜互连的 4 倍。具有优化几何参数的铜铍合金蛇形电路在 90% 应变的 1000 次拉伸测试中表现出极佳的电阻稳定性,不会出现局部分层或失效。发光二极管 (LED) 阵列显示出高达 200% 的超高拉伸应变极限。所提出的方法为未来可穿戴电子设备高拉伸电路的制造提供了一种新颖而有前景的途径。
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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