{"title":"A Highly Stretchable Circuit Based on Metal-Elastomer Composite","authors":"Fankai Kong;Hu Tang;Peng Liu;Xiao Liu;Jiwei Zhao;Junjian Li;Jue Peng","doi":"10.1109/LED.2024.3449153","DOIUrl":null,"url":null,"abstract":"We develop a highly stretchable circuit by utilizing serpentine interconnects made of high-elasticity Cu-Be alloy. An elastic equivalent model of serpentine interconnect is used to optimize the geometric parameters, thereby enhancing its mechanical compatibility with the soft substrate. Furthermore, we propose a rapid fabrication method of highly stretchable circuits through the laser cutting and film transfer techniques. The results indicate that the elastic strain limit of the Cu-Be alloy serpentine interconnect is 4 times that of the Cu interconnect. The Cu-Be alloy serpentine circuit with optimized geometric parameters exhibits an excellent resistance stability under 1000 cycles of tensile testing at 90% strain without local delamination or failure. The light emitting diode (LED) array demonstrates an ultrahigh tensile strain limit of up to 200%. The proposed method can provide a novel and promising way for the fabrication of highly stretchable circuits for future wearable electronic devices.","PeriodicalId":13198,"journal":{"name":"IEEE Electron Device Letters","volume":"45 10","pages":"1937-1940"},"PeriodicalIF":4.1000,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Electron Device Letters","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10644053/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
We develop a highly stretchable circuit by utilizing serpentine interconnects made of high-elasticity Cu-Be alloy. An elastic equivalent model of serpentine interconnect is used to optimize the geometric parameters, thereby enhancing its mechanical compatibility with the soft substrate. Furthermore, we propose a rapid fabrication method of highly stretchable circuits through the laser cutting and film transfer techniques. The results indicate that the elastic strain limit of the Cu-Be alloy serpentine interconnect is 4 times that of the Cu interconnect. The Cu-Be alloy serpentine circuit with optimized geometric parameters exhibits an excellent resistance stability under 1000 cycles of tensile testing at 90% strain without local delamination or failure. The light emitting diode (LED) array demonstrates an ultrahigh tensile strain limit of up to 200%. The proposed method can provide a novel and promising way for the fabrication of highly stretchable circuits for future wearable electronic devices.
期刊介绍:
IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.