The Transient Thermal Coupling of CBGA Solder Joints in Reflow Soldering: Experimental and Numerical Optimization

Abstract

With the rapid advancement of electronic information, electronic components are increasingly trending toward miniaturization and high-density. Reflow soldering has emerged as the predominant method for soldering, but its quality is susceptible to various influencing factors. This study focuses on investigating the reflow soldering process of ceramic ball grid array (CBGA) devices by integrating the Anand constitutive model of solder joints, with the solder joint material being Sn63Pb37. A transient thermodynamic coupling model for the reflow soldering process is established, and the thermal simulation parameters are calibrated through temperature testing. The results indicate that the deviation between simulation and experimental outcomes is below 5%. Furthermore, a comparison of the Anand model and elastic model’s impact on solder joint warping and residual stress reveals that the Anand model yields more precise simulation results. Subsequently, the soldering quality of reflow soldering is analyzed based on Anand model, and the key parameters influencing soldering quality are identified through orthogonal analysis, providing a basis for optimal design. The findings suggest that the temperature of the ninth temperature zone and air supply rate exert the most significant influence on soldering quality. In comparison to the initial temperature curve and the airflow rate, there is a $21~^{\circ }$ C increase in peak temperature, a 20-s prolongation of liquid phase time, a reduction of residual stress by 0.15 MPa, and an increase in printed circuit board (PCB) warping by 0.04 mm.