{"title":"Optimizing Scanning Acoustic Tomography Image Segmentation With Segment Anything Model for Semiconductor Devices","authors":"Thi Thu Ha Vu;Tan Hung Vo;Trong Nhan Nguyen;Jaeyeop Choi;Sudip Mondal;Junghwan Oh","doi":"10.1109/TSM.2024.3444850","DOIUrl":null,"url":null,"abstract":"In recent decades, Scanning Acoustic Tomography (SAT) has become a vital technique for characterizing semiconductor devices in non-destructive evaluation. Precise and efficient segmentation of SAT images is crucial for detecting defects and assessing material properties in the semiconductor industry. However, current manual methods are often expensive and susceptible to human error. This study enhances the segmentation process of SAT images using the deep learning model SemiSA, which is fine-tuned from the Segment Anything model. In our experiments, SemiSA was trained and evaluated on a large-scale dataset from the Ohlabs TSAM-400 system, encompassing various semiconductor devices such as Flip Chip, Power Semiconductor, 6-inch and 12-inch Wafer, Transistor, and Multilayer Ceramic Capacitor. The results demonstrate that SemiSA significantly improves segmentation tasks across all types of SAT images of semiconductor devices. On average, there was a 17.89% enhancement in Dice Similarity Coefficient scores and a 24.26% improvement in Intersection over Union scores across all tasks. Additionally, this work also proposes an efficient framework tailored specifically for SAT images. The main objective of developing this segmentation tool is to provide researchers and experts with a valuable tool for advancing the semiconductor evaluation and quality control field. The code is available at \n<uri>https://github.com/ThuHa96/SemiSA</uri>\n.","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"591-601"},"PeriodicalIF":2.3000,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Semiconductor Manufacturing","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10645767/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
In recent decades, Scanning Acoustic Tomography (SAT) has become a vital technique for characterizing semiconductor devices in non-destructive evaluation. Precise and efficient segmentation of SAT images is crucial for detecting defects and assessing material properties in the semiconductor industry. However, current manual methods are often expensive and susceptible to human error. This study enhances the segmentation process of SAT images using the deep learning model SemiSA, which is fine-tuned from the Segment Anything model. In our experiments, SemiSA was trained and evaluated on a large-scale dataset from the Ohlabs TSAM-400 system, encompassing various semiconductor devices such as Flip Chip, Power Semiconductor, 6-inch and 12-inch Wafer, Transistor, and Multilayer Ceramic Capacitor. The results demonstrate that SemiSA significantly improves segmentation tasks across all types of SAT images of semiconductor devices. On average, there was a 17.89% enhancement in Dice Similarity Coefficient scores and a 24.26% improvement in Intersection over Union scores across all tasks. Additionally, this work also proposes an efficient framework tailored specifically for SAT images. The main objective of developing this segmentation tool is to provide researchers and experts with a valuable tool for advancing the semiconductor evaluation and quality control field. The code is available at
https://github.com/ThuHa96/SemiSA
.
期刊介绍:
The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.