Feature Extraction From Diffraction Images Using a Spatial Light Modulator in Scatterometry

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jinyang Li;Hung-Fei Kuo
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Abstract

The continuous miniaturization of semiconductor devices has increased the demand for advanced process control technologies. This process requires real-time measurement systems to monitor manufacturing parameters to ensure efficiency and high quality. This study introduces a novel optical module that uses a spatial light modulator to extract key-point intensity distributions from diffraction images in scatterometry. The efficacy of this method is demonstrated on a grating target with a pitch of 855 nm using a feature extraction algorithm that identifies key point locations based on calculated diffraction images. A particularly designed off-axis extraction pattern facilitates the acquisition of key-point intensity distributions. Moreover, incorporating a cylindrical lens into the optical setup reduces the image feature dimensionality, thereby decreasing the data storage space and enabling the output in a streamlined vector format conducive to further analysis. Experimental data on the development of this scatterometry-based optical module and the subsequent validation of the key-point extraction method indicate a maximum mean absolute error of 0.0080 and a cosine similarity consistently above 0.9999. This study integrates image analysis and measurement techniques by optics, providing a more efficient pathway for key-point extraction in diffraction images, offering the potential for improving real-time process monitoring in the semiconductor manufacturing industry.
在散射测量中使用空间光调制器从衍射图像中提取特征
半导体器件的不断微型化增加了对先进过程控制技术的需求。这一过程需要实时测量系统来监控制造参数,以确保高效率和高质量。本研究介绍了一种新型光学模块,它使用空间光调制器从散射测量中的衍射图像中提取关键点强度分布。该方法在一个间距为 855 nm 的光栅目标上演示了其功效,其使用的特征提取算法可根据计算出的衍射图像识别关键点位置。特别设计的离轴提取模式有助于获取关键点的强度分布。此外,在光学装置中加入圆柱透镜可降低图像特征维度,从而减少数据存储空间,并能以有利于进一步分析的精简矢量格式输出。有关开发这种基于散射测量的光学模块以及随后验证关键点提取方法的实验数据表明,最大平均绝对误差为 0.0080,余弦相似度始终高于 0.9999。这项研究通过光学技术整合了图像分析和测量技术,为衍射图像中的关键点提取提供了更有效的途径,为改善半导体制造行业的实时过程监控提供了可能。
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来源期刊
IEEE Transactions on Semiconductor Manufacturing
IEEE Transactions on Semiconductor Manufacturing 工程技术-工程:电子与电气
CiteScore
5.20
自引率
11.10%
发文量
101
审稿时长
3.3 months
期刊介绍: The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.
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