Hongbo Li, Jian Zhang, Chongyong Guo, Yuanya Liu, Chunyan Liu, Yu Wang, Jianjun Li, Hui Yuan and Xingcheng Jin
{"title":"Effect of atomic layer deposition process parameters on TiN electrode for Hf0.5Zr0.5O2 ferroelectric capacitor","authors":"Hongbo Li, Jian Zhang, Chongyong Guo, Yuanya Liu, Chunyan Liu, Yu Wang, Jianjun Li, Hui Yuan and Xingcheng Jin","doi":"10.1088/1361-6641/ad7637","DOIUrl":null,"url":null,"abstract":"Hf0.5Zr0.5O2 (HZO), an innovative and exceptional ferroelectric material, exhibits remarkably high sensitivity, making it particularly vulnerable to electrode effect. Titanium nitride (TiN) is a commonly employed as electrode material in the complementary metal–oxide–semiconductor process. Optimizing the process parameters of preparing TiN film can alter matching degree with HZO capacitor, so as to find the optimal parameters of TiN process to improve ferroelectric property of HZO. In this study, the impact of key process parameters in atomic layer deposition (ALD) TiN, including cycle number, TiCl4 and NH3 pulse time, process temperature (Tp) on film thickness, crystalline phases of TiN, square resistivity (Rs), surface average roughness (Ra) and the root-mean-square roughness (Rq) of TiN film are comprehensively investigated. Through optimization, ∼10 nm ALD TiN film can achieve excellent uniformity of 0.43%, low Rs of 286.9 Ω/□, improved Ra and Rq of 1.82 Å and 2.28 Å. The results show that the maximum 2 times remnant polarization (2Pr) of the HZO ferroelectric capacitor with optimized TiN electrodes can reach 35.17 µC cm−2, and the switching cycle endurance exceeds 8 × 107.","PeriodicalId":21585,"journal":{"name":"Semiconductor Science and Technology","volume":"6 1","pages":""},"PeriodicalIF":1.9000,"publicationDate":"2024-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Semiconductor Science and Technology","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1088/1361-6641/ad7637","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Hf0.5Zr0.5O2 (HZO), an innovative and exceptional ferroelectric material, exhibits remarkably high sensitivity, making it particularly vulnerable to electrode effect. Titanium nitride (TiN) is a commonly employed as electrode material in the complementary metal–oxide–semiconductor process. Optimizing the process parameters of preparing TiN film can alter matching degree with HZO capacitor, so as to find the optimal parameters of TiN process to improve ferroelectric property of HZO. In this study, the impact of key process parameters in atomic layer deposition (ALD) TiN, including cycle number, TiCl4 and NH3 pulse time, process temperature (Tp) on film thickness, crystalline phases of TiN, square resistivity (Rs), surface average roughness (Ra) and the root-mean-square roughness (Rq) of TiN film are comprehensively investigated. Through optimization, ∼10 nm ALD TiN film can achieve excellent uniformity of 0.43%, low Rs of 286.9 Ω/□, improved Ra and Rq of 1.82 Å and 2.28 Å. The results show that the maximum 2 times remnant polarization (2Pr) of the HZO ferroelectric capacitor with optimized TiN electrodes can reach 35.17 µC cm−2, and the switching cycle endurance exceeds 8 × 107.
期刊介绍:
Devoted to semiconductor research, Semiconductor Science and Technology''s multidisciplinary approach reflects the far-reaching nature of this topic.
The scope of the journal covers fundamental and applied experimental and theoretical studies of the properties of non-organic, organic and oxide semiconductors, their interfaces and devices, including:
fundamental properties
materials and nanostructures
devices and applications
fabrication and processing
new analytical techniques
simulation
emerging fields:
materials and devices for quantum technologies
hybrid structures and devices
2D and topological materials
metamaterials
semiconductors for energy
flexible electronics.