Durability distribution prediction of thermo-mechanical solder fatigue failure with uncertainty propagation by eigenvector dimension reduction method

IF 1.6 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Chien-Ming Huang , Jeffrey W. Herrmann
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引用次数: 0

Abstract

Current fatigue models for predicting the cycles to failure (fatigue life) of solder joints under thermo-mechanical loadings can only provide point estimates of the characteristic life or median life. Nevertheless, the prediction of fatigue life should be distributed with the uncertainties. Unfortunately, previous work has not discussed the uncertainty of the cycles to failure, especially for the solder joints under temperature cycling. Therefore, the uncertainty propagation of the cycles to failure is necessary to better estimate the distribution of the fatigue life of solder joint. This paper presents a four-part uncertainty propagation approach for this problem. Part I models the solder joint using finite element analysis. Part II uses the eigenvector dimension reduction method and finite element analysis simulation tool to determine the distribution of the system response, which is the strain energy density accumulation. Part III uses a fatigue model to convert the distribution of strain energy density accumulation into a distribution of characteristic life (in cycles) by choosing the appropriate fatigue model. Part IV determines the cumulative distribution functions of the fatigue life of solder joint. We applied this method to a specific example of a solder joint for a ball grid array component to illustrate the procedure. This paper contributes to the field of durability prediction by proposing a novel uncertainty propagation method to estimate the uncertainty in the fatigue life of solder joints. Using this method can help engineers make solder material selection decisions and understand the factors that contribute most to solder joint fatigue life uncertainty.

用特征向量维度缩减法预测带有不确定性传播的热机械焊料疲劳失效的耐久性分布
目前用于预测热机械负载下焊点失效周期(疲劳寿命)的疲劳模型只能提供特征寿命或中位寿命的点估算值。然而,疲劳寿命的预测应与不确定性分布在一起。遗憾的是,之前的工作并未讨论失效循环的不确定性,尤其是温度循环下的焊点。因此,为了更好地估计焊点疲劳寿命的分布,有必要对失效循环进行不确定性传播。本文针对这一问题提出了一种由四个部分组成的不确定性传播方法。第一部分使用有限元分析建立焊点模型。第二部分使用特征向量维度缩减法和有限元分析模拟工具确定系统响应的分布,即应变能量密度累积。第三部分使用疲劳模型,通过选择适当的疲劳模型,将应变能密度累积分布转化为特征寿命(以周期为单位)的分布。第四部分确定焊点疲劳寿命的累积分布函数。我们将此方法应用于球栅阵列元件焊点的具体实例,以说明该过程。本文提出了一种估算焊点疲劳寿命不确定性的新型不确定性传播方法,为耐久性预测领域做出了贡献。使用这种方法可以帮助工程师做出焊接材料选择决策,并了解造成焊点疲劳寿命不确定性的主要因素。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Microelectronics Reliability
Microelectronics Reliability 工程技术-工程:电子与电气
CiteScore
3.30
自引率
12.50%
发文量
342
审稿时长
68 days
期刊介绍: Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged. Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
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