SOT-MRAM-Based Design for Energy-Efficient and Reliable Binary Neural Network Acceleration

IF 2.9 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Ahmed Shaban;Shreshtha Gothalyan;Tuo-Hung Hou;Manan Suri
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Abstract

Binary neural networks (BNNs) are a highly promising option for realizing lightweight and efficient computing for applications on the edge. Spin-orbit torque MRAM (SOT-MRAM) has emerged as an attractive option for realizing fast and energy-efficient design. In this work, we propose a 4T-2R memory cell using viable and experimentally demonstrated SOT magnetic tunnel junction device (SOT-MTJ) for realizing highly energy-efficient XNOR operation (primary operation in BNNs). We also propose a pulse scheme to mitigate the inherent challenge of increased write error rate (WER) in SOT-MRAM device while achieving energy-efficient write. We perform 1000-point Monte Carlo (MC) simulations and demonstrate a bit error rate (BER) of 0.1– $5\times {10}^{-{3}}$ with extremely low energy consumption of ~4.8 fJ per XNOR operation. We also perform system-level simulations to show robustness of our cell by incorporating the asymmetric BERs resulting due to thermal noise and process variations (PVs) on CIFAR-10 classification task using VGG network. Our proposed cell holds potential for highly energy-efficient and error-tolerant BNNs on edge devices.
基于 SOT-MRAM 的高能效、可靠的二进制神经网络加速设计
二元神经网络(BNN)是为边缘应用实现轻量级高效计算的一种极具前景的选择。自旋轨道力矩 MRAM(SOT-MRAM)已成为实现快速、高能效设计的一种极具吸引力的选择。在这项工作中,我们提出了一种 4T-2R 存储单元,它采用了可行并经实验验证的 SOT 磁隧道结器件 (SOT-MTJ),可实现高能效的 XNOR 操作(BNN 中的主要操作)。我们还提出了一种脉冲方案,在实现高能效写入的同时,缓解 SOT-MRAM 器件写入错误率 (WER) 增加的固有挑战。我们进行了 1000 点蒙特卡罗(MC)仿真,证明误码率(BER)为 0.1- $5\times {10}^{-{3}}$ ,每次 XNOR 操作的能耗极低,仅为 ~4.8 fJ。我们还利用 VGG 网络在 CIFAR-10 分类任务中结合热噪声和工艺变化 (PV) 导致的非对称误码率进行了系统级仿真,以显示我们的单元的鲁棒性。我们提出的单元具有在边缘设备上实现高能效和容错 BNN 的潜力。
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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