Yi Jiang , Yanning Chen , Fang Liu , Bo Wu , Yongfeng Deng , Dawei Gao , Junkang Li , John Robertson , Rui Zhang
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引用次数: 0
Abstract
In this study, the weak bias temperature instability (BTI) in both Si p- and n-MOSFETs was systematically investigated using subthreshold swing degradation (ΔS factor), threshold voltage shift (ΔVth) and flicker noise (1/f noise) characteristics. It is found that the 1/f noise characteristics exhibit more pronounced deterioration compared to the Si/SiO2 interface degeneration under weak BTI stress. Furthermore, the observed linear relationship between the 1/f noise characteristics and MOS interface trap density was confirmed by the carrier number fluctuation model, indicating that 1/f noise characteristics could be considered as a sensitive and effective indicator for assessing MOS interface quality after weak BTI stress.
期刊介绍:
Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.
Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.