Improved Electrothermal Properties and High-Frequency Discharge Performance Verification of MWCNT/SiC Complex-Modified Silicone Gel

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Wei Wang;Bei Li;Sigeng Li;Xincheng Wang;Yanfeng Gong;Jian Wang;Hanwen Ren;Qingmin Li
{"title":"Improved Electrothermal Properties and High-Frequency Discharge Performance Verification of MWCNT/SiC Complex-Modified Silicone Gel","authors":"Wei Wang;Bei Li;Sigeng Li;Xincheng Wang;Yanfeng Gong;Jian Wang;Hanwen Ren;Qingmin Li","doi":"10.1109/TCPMT.2024.3410379","DOIUrl":null,"url":null,"abstract":"As power electronic devices continue to advance toward higher voltage and power levels, the issue of insulation failure in silicone gel package materials is becoming more noticeable. Therefore, there is a pressing need to develop a high-performance silicone potting material. This research presents the preparation of a silicone gel filled with multiwalled carbon nanotubes (MWCNTs) and micrometer silicon carbide (SiC) using the physical blending method. Then, the composite’s electrothermal properties and high-frequency partial discharge characteristics are explicitly investigated. The experimental findings indicate that when the MWCNT filling ratio increases from 0%vol to 0.7%vol, the modified silicone gel has pronounced nonlinear conductivity properties, reaching a maximum nonlinear coefficient of 9.34. The rise in shallow and deep trap density ratio expedites the dissipation rate of surface charge. Also, the thermal conductivity is also augmented by 59.38%. Nevertheless, the dielectric loss exhibits a progressive increase. Finally, the modified silicone gel was used in the potting package module, and high-frequency partial discharge experiments were conducted. It was found that the silicone gel filled with 0.3%vol MWCNT/9.7%vol SiC could effectively inhibit the partial discharge. This study will provide practical ideas and a theoretical basis for developing new high-performance insulating materials for the insulated-gate bipolar transistor (IGBT) package.","PeriodicalId":13085,"journal":{"name":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"14 8","pages":"1347-1358"},"PeriodicalIF":2.3000,"publicationDate":"2024-06-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components, Packaging and Manufacturing Technology","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10551261/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
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Abstract

As power electronic devices continue to advance toward higher voltage and power levels, the issue of insulation failure in silicone gel package materials is becoming more noticeable. Therefore, there is a pressing need to develop a high-performance silicone potting material. This research presents the preparation of a silicone gel filled with multiwalled carbon nanotubes (MWCNTs) and micrometer silicon carbide (SiC) using the physical blending method. Then, the composite’s electrothermal properties and high-frequency partial discharge characteristics are explicitly investigated. The experimental findings indicate that when the MWCNT filling ratio increases from 0%vol to 0.7%vol, the modified silicone gel has pronounced nonlinear conductivity properties, reaching a maximum nonlinear coefficient of 9.34. The rise in shallow and deep trap density ratio expedites the dissipation rate of surface charge. Also, the thermal conductivity is also augmented by 59.38%. Nevertheless, the dielectric loss exhibits a progressive increase. Finally, the modified silicone gel was used in the potting package module, and high-frequency partial discharge experiments were conducted. It was found that the silicone gel filled with 0.3%vol MWCNT/9.7%vol SiC could effectively inhibit the partial discharge. This study will provide practical ideas and a theoretical basis for developing new high-performance insulating materials for the insulated-gate bipolar transistor (IGBT) package.
改良的 MWCNT/SiC 复合改性硅凝胶电热特性和高频放电性能验证
随着电力电子设备不断向更高电压和功率水平发展,硅凝胶封装材料的绝缘失效问题日益突出。因此,开发高性能硅胶灌封材料迫在眉睫。本研究采用物理混合法制备了一种填充了多壁碳纳米管(MWCNT)和微米碳化硅(SiC)的硅凝胶。然后,明确研究了该复合材料的电热性能和高频局部放电特性。实验结果表明,当 MWCNT 填充率从 0%vol 增加到 0.7%vol 时,改性硅凝胶具有明显的非线性导电特性,最大非线性系数达到 9.34。浅阱和深阱密度比的增加加快了表面电荷的耗散速度。此外,热导率也提高了 59.38%。然而,介电损耗却呈现出逐渐增加的趋势。最后,将改性硅凝胶用于灌封封装模块,并进行了高频局部放电实验。结果发现,填充了 0.3%vol MWCNT/9.7%vol SiC 的硅凝胶能有效抑制局部放电。这项研究将为开发用于绝缘栅双极晶体管(IGBT)封装的新型高性能绝缘材料提供实践思路和理论依据。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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