Comprehensive Evaluation of Junctionless and Inversion-Mode Nanowire MOSFETs Performance at High Temperatures

IF 2 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
Rhaycen R. Prates;Sylvain Barraud;Mikael Cassé;Maud Vinet;Olivier Faynot;Marcelo A. Pavanello
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Abstract

This work aims to perform a comprehensive comparison of the electrical properties of junctionless and inversion-mode nanowires MOSFETS, fabricated with similar gate stack and state-of-art process, in the temperature range from 300 K to 580 K. The comparative analysis is performed through the main electrical parameters of the devices, such as the threshold voltage, subthreshold current and slope, DIBL, conduction current, mobility, and maximum transconductance extracted from experimental data. Devices with different fin widths are compared. It is demonstrated that the inversion-mode nanowire transistors present higher performance with three times higher maximum transconductance and conduction current and twice higher low field mobility than the junctionless’ with a fin width of 10 nm at a fixed temperature. On the other hand, the junctionless nanowire transistors presented higher thermal stability of their electrical parameters with a 75% lower variation of maximum transconductance with temperature, 77% lower maximum transconductance variation with temperature, and 22% lower temperature coefficient of mobility.
全面评估无结和反转模式纳米线 MOSFET 在高温下的性能
本研究旨在全面比较无结和反转模式纳米线 MOSFETS 在 300 K 至 580 K 温度范围内的电气特性,这两种器件均采用类似的栅极堆栈和最先进的工艺制造而成。对不同鳍片宽度的器件进行了比较。结果表明,在固定温度下,反转模式纳米线晶体管具有更高的性能,其最大跨导和传导电流比翅片宽度为 10 纳米的无结晶体管高出三倍,低场迁移率高出两倍。另一方面,无结纳米线晶体管的电气参数具有更高的热稳定性,最大跨导随温度的变化降低了 75%,最大跨导随温度的变化降低了 77%,迁移率的温度系数降低了 22%。
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来源期刊
IEEE Journal of the Electron Devices Society
IEEE Journal of the Electron Devices Society Biochemistry, Genetics and Molecular Biology-Biotechnology
CiteScore
5.20
自引率
4.30%
发文量
124
审稿时长
9 weeks
期刊介绍: The IEEE Journal of the Electron Devices Society (J-EDS) is an open-access, fully electronic scientific journal publishing papers ranging from fundamental to applied research that are scientifically rigorous and relevant to electron devices. The J-EDS publishes original and significant contributions relating to the theory, modelling, design, performance, and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanodevices, optoelectronics, photovoltaics, power IC''s, and micro-sensors. Tutorial and review papers on these subjects are, also, published. And, occasionally special issues with a collection of papers on particular areas in more depth and breadth are, also, published. J-EDS publishes all papers that are judged to be technically valid and original.
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