Effects of soldering temperatures and composition on the microstructures and shear properties of Sn58Bi-xSAC0307/ENIG solder joints

IF 1.7 4区材料科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

Soldering & Surface Mount Technology Pub Date : 2024-07-25 DOI:10.1108/ssmt-03-2024-0014

Mengxia Jiang, Yang Liu, Yuxiong Xue, Guangbao Shan, Jun Lv, Mairui Huang

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引用次数: 0

Abstract

Purpose

This paper aims to systematically study the effects of reflow temperature and SAC0307 (SAC) content on the micromorphology and mechanical properties of Sn58Bi-xSAC0307 composite solder joints to meet the requirements of high integration and low-temperature packaging of devices and provide references for the application of composite solder joints.

Design/methodology/approach

Sn58Bi and SAC0307 solder paste was mechanically mixed in different proportions to prepare Sn58Bi-xSAC0307/ENIG solder joints. The thermal properties, microstructure and mechanical properties of the composite solder joints were studied.

Findings

As SAC content in the solder increases, the balling temperature of SnBi-SAC solder gradually increases. The addition of SAC alloy reduces the grain size of large Bi-rich phase, and there are small-sized dispersed Bi and Ag3Sn particles in the bulk solder. The intermetallic compounds composition of the SnBi-xSAC/ENIG solder joint changes from Ni3Sn4 to (Ni, Cu)3Sn4 and (Cu, Ni)6Sn5 with SAC increasing. As the soldering temperature increases, the strength of all solder joints shows a rising trend. Among them, the shear strength of SnBi-20SAC solder joints at a reflow temperature of 150°C is approximately 37 MPa. As the reflow temperature increases to 250°C, the shear strength of solder joints increases to approximately 67 MPa.

Originality/value

This study provides a reference for the optimization of low-temperature solder composition and soldering process under different package designs.

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焊接温度和成分对 Sn58Bi-xSAC0307/ENIG 焊点微观结构和剪切特性的影响

目的本文旨在系统研究回流焊温度和 SAC0307（SAC）含量对 Sn58Bi-xSAC0307 复合焊点微观形貌和力学性能的影响，以满足器件高集成度和低温封装的要求，为复合焊点的应用提供参考。研究结果随着焊料中 SAC 含量的增加，SnBi-SAC 焊料的球化温度逐渐升高。SAC 合金的加入减小了大的富铋相的晶粒尺寸，在块状焊料中出现了小尺寸的分散铋和 Ag3Sn 颗粒。随着 SAC 的增加，SnBi-xSAC/ENIG 焊点的金属间化合物成分从 Ni3Sn4 变为（Ni，Cu）3Sn4 和（Cu，Ni）6Sn5。随着焊接温度的升高，所有焊点的强度都呈上升趋势。其中，在回流温度为 150°C 时，SnBi-20SAC 焊点的剪切强度约为 37 兆帕。随着回流焊温度升高到 250°C，焊点的剪切强度增加到约 67 MPa。原创性/价值这项研究为优化不同封装设计下的低温焊料成分和焊接工艺提供了参考。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Soldering & Surface Mount Technology 工程技术-材料科学：综合

CiteScore

4.10

自引率

15.00%

发文量

审稿时长

>12 weeks

期刊介绍： Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.