Boundless Engineering for Yield to Cope With the Complexity of High-Volume Manufacturing

IF 2.3 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Transactions on Semiconductor Manufacturing Pub Date : 2024-07-15 DOI:10.1109/tsm.2024.3428936

Giyoung Yang, Lay Hoon Loh, Emma Greer, Xiaodong Zhang, Shivendra Pandey, Saramma Varghese, Wee Hong Goh, Jianjun Cheng, Eric Hao Guan, Angelo Pinto

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无止境的产量工程，应对大批量生产的复杂性

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

IEEE Transactions on Semiconductor Manufacturing 工程技术-工程：电子与电气

CiteScore

5.20

自引率

11.10%

发文量

101

审稿时长

3.3 months

期刊介绍： The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.