Martin Markwitz , Peter P. Murmu , Song Yi Back , Takao Mori , John V. Kennedy , Ben J. Ruck
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引用次数: 0
Abstract
Copper(I) iodide (CuI) is the leading inorganic -type transparent conductor, attracting major attention for its promising optoelectronic properties and facile growth methods, although, commercial uptake is limited due to its as-of-yet insufficient electrical conductivity. Doping CuI with the chalcogens (O, S, Se, Te) is a viable route to tune its electrical conductivity for applications such as in thin film transistors, hole transport layers in solar cells, and transparent thermoelectric generators. The heaviest chalcogen element, Te, is yet to be explored in heavily intrinsically -type doped CuI at non-alloying concentrations, the subject of the present work. We report the effects of tellurium at the boundary between the doping and alloying regime (up to a maximum of 2.4 % Te) in CuI thin films and investigation the variation in the thermoelectric properties and electronic band structure of the material. Ion implanting tellurium into CuI led to a progressive reduction in the films' work functions from 4.9 eV to 4.5 eV while the ionization potential remained unchanged, measured through photoemission spectrometry. This signified a modulation of the Fermi energy relative to the valence band edge, having a major effect on the materials' electrical conductivity and Seebeck coefficient, the former decreasing by 3 orders of magnitude, while the latter increased by 80 %. We conducted density functional theory (DFT) calculations to elucidate the effect of tellurium doping on the band structure of CuI. Tellurium doping corroborated the shift of Fermi energy, the incorporation of impurity acceptor states deeper into the band gap, in addition to disordering the valence band maximum. This work shows that, the Fermi energy in heavily -type doped CuI can be moved away from the valence band through Te doping in addition to introducing band disorder, useful for controlling the hosts’ transport properties.
碘化铜(CuI)是领先的无机 p 型透明导体,因其良好的光电特性和简便的生长方法而备受关注。在 CuI 中掺杂查尔根元素(O、S、Se、Te)是调整其导电性的一条可行途径,可用于薄膜晶体管、太阳能电池中的空穴传输层和透明热电发生器等应用。最重的查尔根元素 Te 尚未在非合金浓度的重本征 p 型掺杂 CuI 中得到应用,这也是本研究的主题。我们报告了碲在 CuI 薄膜中掺杂和合金化体系(最高 2.4% Te)边界的影响,并研究了材料热电特性和电子能带结构的变化。通过光发射光谱法测量,将碲离子植入 CuI 后,薄膜的功函数从 4.9 eV 逐步降低到 4.5 eV,而电离电势保持不变。这表明费米能相对于价带边缘发生了变化,对材料的导电性和塞贝克系数产生了重大影响,前者降低了 3 个数量级,而后者增加了 80%。我们进行了密度泛函理论(DFT)计算,以阐明碲掺杂对 CuI 带结构的影响。碲的掺杂证实了费米能的移动、杂质受体态在带隙更深处的结合,以及价带最大值的失调。这项工作表明,通过掺杂碲,重度 p 型掺杂的 CuI 中的费米能可以远离价带,同时引入能带无序,这对控制宿主的传输特性非常有用。
期刊介绍:
Materials Today Physics is a multi-disciplinary journal focused on the physics of materials, encompassing both the physical properties and materials synthesis. Operating at the interface of physics and materials science, this journal covers one of the largest and most dynamic fields within physical science. The forefront research in materials physics is driving advancements in new materials, uncovering new physics, and fostering novel applications at an unprecedented pace.