The HRDL Interposer Technology Using Metal/Polymer Hybrid Bonding and Its Characteristics

Abstract

This article aims to comprehensively explore silicon, glass, organic, and RDL (Redistribution Layer) interposers, comparing their technological features, advantages, and associated challenges. Additionally, a pioneering technology, termed Hyper RDL interposer (HRDL), which integrates temporary bonding and low-temperature hybrid bonding techniques to create an RDL interposer with low warpage, high layer count, and minimal thermal accumulation effects, is introduced through new research results. The forthcoming discussion will rigorously examine the impact of interposer technologies in the semiconductor industry and advanced technology sectors, facilitating progress in critical areas, including high-performance computing (HPC), artificial intelligence (AI), and high-bandwidth applications.