{"title":"A Real-Time Automatic Structural-Loss Detection and Stopping Rule of Semiconductor Single-Crystal-Silicon-Growth <100> and <111>","authors":"Wheyming Tina Song;Yu-Fan Liao","doi":"10.1109/TSM.2024.3421926","DOIUrl":null,"url":null,"abstract":"The occurrence of the “structural-loss” defect during single-crystal silicon growth (SCSG) is a significant issue in semiconductor manufacturing. When structural-loss occurs, it signifies a deviation from the desired quality of single-crystal formation, leading to the need to halt the growth process. Currently, there is a lack of scholarly literature addressing the determination of an optimal stopping time to promptly halt the process upon the occurrence of the defect on-line. Our research makes a substantial contribution by addressing this gap in the SCSG process, specifically focusing on orientations <100> and <111>. The study utilizes advanced AI with YOLO-v7 and innovative approaches. These include precise annotation of crystal misorientation features through a comprehensive definition of structural-loss and novel labeling techniques, identification of optimal hyper-parameters through a robust design, and the implementation of effective stopping rule mechanisms. Significant progress has been achieved in decision-making through the implementation of the stoping time shift to terminate the SCSG process within an average of less than 3 minutes for <100> orientations (with a standard error of 0.3 minutes) and less than 5 minutes for <111> orientations (with a standard error of 0.5 minutes). The promising results indicate that the proposed approaches have the capability to substitute manual inspections, opening up possibilities for new perspectives in this particular field.","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 3","pages":"304-315"},"PeriodicalIF":2.3000,"publicationDate":"2024-07-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Semiconductor Manufacturing","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10586860/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The occurrence of the “structural-loss” defect during single-crystal silicon growth (SCSG) is a significant issue in semiconductor manufacturing. When structural-loss occurs, it signifies a deviation from the desired quality of single-crystal formation, leading to the need to halt the growth process. Currently, there is a lack of scholarly literature addressing the determination of an optimal stopping time to promptly halt the process upon the occurrence of the defect on-line. Our research makes a substantial contribution by addressing this gap in the SCSG process, specifically focusing on orientations <100> and <111>. The study utilizes advanced AI with YOLO-v7 and innovative approaches. These include precise annotation of crystal misorientation features through a comprehensive definition of structural-loss and novel labeling techniques, identification of optimal hyper-parameters through a robust design, and the implementation of effective stopping rule mechanisms. Significant progress has been achieved in decision-making through the implementation of the stoping time shift to terminate the SCSG process within an average of less than 3 minutes for <100> orientations (with a standard error of 0.3 minutes) and less than 5 minutes for <111> orientations (with a standard error of 0.5 minutes). The promising results indicate that the proposed approaches have the capability to substitute manual inspections, opening up possibilities for new perspectives in this particular field.
期刊介绍:
The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.