Ultracompact Bandpass Filter With Multiple Transmission Zeros and Low Insertion Loss

IF 2.3 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Chenyin Zhou;Shuai Zhang;Sulei Fu;Weibiao Wang;Yu Guo
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Abstract

Two ultracompact bandpass (UCB) filters have been proposed. To the best of the authors’ knowledge, the filter I is the minimum size microwave bandpass filter ever reported. The proposed circuits successfully integrate an integrated passive device (IPD) technique-based high-Q capacitor and energy coupling circuit with a printed circuit board (PCB) substrate. By creating both separate electric and magnetic coupling path (SEMCP) and source-load coupling path, two transmission zeros (TZs) on the stopband are generated. A wide stopband suppression and good passband selectivity are achieved by this technique. New energy coupling circuits are designed to reduce energy coupling losses of the compact filters; therefore, both compact size and low insertion loss (IL) can be achieved by the filters. Two particular examples of the filter are implemented and experimentally demonstrated. The results show a filter with a size of $0.55\times 1.38$ mm2 ( $5.2\times 10^{-4}~\lambda _{g}^{2}$ at 3.7 GHz), an IL of 2.2 dB at center frequency and two TZs on the upper stopband. The other filter demonstrated with a size of $2.1\times 1.32$ mm2 ( $2.7\times 10^{-3}~\lambda _{g}^{2}$ at 4.5 GHz), an IL of 1.81 dB at the center frequency and two controllable TZs on the stopband.
具有多个传输零点和低插入损耗的超小型带通滤波器
我们提出了两个超小型带通(UCB)滤波器。据作者所知,滤波器 I 是迄今所报道的最小尺寸微波带通滤波器。所提出的电路成功地将基于集成无源器件(IPD)技术的高 Q 值电容器和能量耦合电路与印刷电路板(PCB)基板集成在一起。通过创建独立的电磁耦合路径 (SEMCP) 和源负载耦合路径,在阻带上产生了两个传输零点 (TZ)。通过这种技术,可以实现较宽的停带抑制和良好的通带选择性。设计了新的能量耦合电路,以减少紧凑型滤波器的能量耦合损耗;因此,滤波器可以实现紧凑的尺寸和低插入损耗(IL)。我们实施并实验演示了两个特定的滤波器实例。结果显示,一个滤波器的尺寸为 0.55 美元乘以 1.38 平方毫米(3.7 千兆赫时为 5.2 美元乘以 10^{-4}~\lambda _{g}^{2}美元),中心频率的插入损耗为 2.2 分贝,上阻带有两个 TZ。另一种滤波器的尺寸为 2.1times 1.32$ mm2(2.7times 10^{-3}~lambda _{g}^{2}$,频率为 4.5 GHz),中心频率的内阻为 1.81 dB,阻带上有两个可控的 TZ。
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来源期刊
IEEE Transactions on Components, Packaging and Manufacturing Technology
IEEE Transactions on Components, Packaging and Manufacturing Technology ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC
CiteScore
4.70
自引率
13.60%
发文量
203
审稿时长
3 months
期刊介绍: IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
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