{"title":"Design of Highly Reliable 14T and 16T SRAM Cells Combined With Layout Harden Technique","authors":"Feng Wei;Xiaole Cui;Qixue Zhang;Sunrui Zhang;Xiaoxin Cui;Xing Zhang","doi":"10.1109/TDMR.2024.3417961","DOIUrl":null,"url":null,"abstract":"The node upset may occur in the memory cell if the charged particle from cosmos rays or packaging materials strikes the integrated circuit. Radiation-hardened-by-design (RHBD) techniques introduce redundant transistors in the SRAM cell to improve its ability of recovering from the undesired node upset. However, the extra redundant transistors may increase the number of sensitive nodes in the SRAM cell, which decreases its capability of node-upset tolerance in turn. This work proposes an RHBD 14T SRAM cell and an RHBD 16T SRAM cell. Both the proposed SRAM cells only have two sensitive nodes. The proposed SRAM cells are able to recover from all the SNU cases. The layout harden technique is used to protect the proposed cells from SEMNU, and the blank of the hardened layout is reused so the proposed 14T and 16T SRAM cells consume the same area. Although the proposed cells have more transistors, the hardened layout areas of NS-10T/ PS-10T/ RHD-12T/ RHBD-10T/ RHBD-10T[VLSI]/ QUCCE-12T are respectively \n<inline-formula> <tex-math>$1.78\\times $ </tex-math></inline-formula>\n/\n<inline-formula> <tex-math>$1.78\\times $ </tex-math></inline-formula>\n/\n<inline-formula> <tex-math>$1.83\\times $ </tex-math></inline-formula>\n/\n<inline-formula> <tex-math>$1.78\\times $ </tex-math></inline-formula>\n/\n<inline-formula> <tex-math>$1.78\\times $ </tex-math></inline-formula>\n/\n<inline-formula> <tex-math>$1.99\\times $ </tex-math></inline-formula>\n larger than that of the proposed cells. The reason is that the layout harden technique is easier to be applied to the proposed cells because they only have two sensitive nodes.","PeriodicalId":448,"journal":{"name":"IEEE Transactions on Device and Materials Reliability","volume":"24 3","pages":"390-400"},"PeriodicalIF":2.5000,"publicationDate":"2024-06-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Device and Materials Reliability","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10570044/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
The node upset may occur in the memory cell if the charged particle from cosmos rays or packaging materials strikes the integrated circuit. Radiation-hardened-by-design (RHBD) techniques introduce redundant transistors in the SRAM cell to improve its ability of recovering from the undesired node upset. However, the extra redundant transistors may increase the number of sensitive nodes in the SRAM cell, which decreases its capability of node-upset tolerance in turn. This work proposes an RHBD 14T SRAM cell and an RHBD 16T SRAM cell. Both the proposed SRAM cells only have two sensitive nodes. The proposed SRAM cells are able to recover from all the SNU cases. The layout harden technique is used to protect the proposed cells from SEMNU, and the blank of the hardened layout is reused so the proposed 14T and 16T SRAM cells consume the same area. Although the proposed cells have more transistors, the hardened layout areas of NS-10T/ PS-10T/ RHD-12T/ RHBD-10T/ RHBD-10T[VLSI]/ QUCCE-12T are respectively
$1.78\times $
/
$1.78\times $
/
$1.83\times $
/
$1.78\times $
/
$1.78\times $
/
$1.99\times $
larger than that of the proposed cells. The reason is that the layout harden technique is easier to be applied to the proposed cells because they only have two sensitive nodes.
期刊介绍:
The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.